Waferpedia

Teradyne

ETS 88

Test & ProbeTeradyne ETS 88 family
Research Quality: 50% complete
Email

The Teradyne ETS 88 is a precision power and analog test system for production board test. The ETS 88 configuration includes eight DPS 16 modules, seven SPU 100 modules, fifteen APU 12 modules, four QTMU modules, and one CBIT board.[1]

ETS 88 — Inventory photo
Fig. 01ETS 88Inventory photo[2]

What it is

General reference — not yet source-verified

A semiconductor test system applies electrical stimuli to a device under test and measures the device response against programmed limits. A test system of this class is used to verify electrical behavior, screen for defects, and sort parts by pass or fail criteria. A test system of this class commonly interfaces with a handler or a probed contact arrangement so that devices can be contacted repeatably during production testing.

How it works

General reference — not yet source-verified

A semiconductor tester of this class drives signals and power into the device under test through a contact interface and measures resulting voltages, currents, timing relationships, and logic states. A semiconductor tester of this class combines stimulus resources, measurement resources, timing control, and test software so that a programmed sequence can exercise device functions and evaluate the returned results. A semiconductor tester of this class commonly uses interchangeable instruments and interface hardware to match the electrical requirements of different products.

Where it fits in the process flow

General reference — not yet source-verified

An electrical test system of this class sits after wafer fabrication and packaging steps, at points where devices or assemblies are ready for electrical verification. An electrical test system of this class is used in production flows that need outgoing quality screening, characterization, or functional confirmation before subsequent assembly stages or shipment to the next manufacturing operation. When used with probing, an electrical test system of this class can support device contact before singulation or package completion. When used with handling equipment, an electrical test system of this class can support packaged-device test in automated production flow.

Applications

General reference — not yet source-verified

A test system of this class is used for electrical verification of semiconductor devices and other electronic units that must be contacted and measured under controlled conditions. A test system of this class can be applied to functional checks, parametric measurements, continuity verification, isolation checks, and stress-related electrical evaluations, depending on the installed instrumentation and test program. A test system of this class is also used where production operations need repeatable pass or fail decisions based on measured electrical behavior.

What do the numbers mean?

Control & software3

PC[3]
Accurate?
Computer vintage
2011[3]
Accurate?
Controller PC vintage
2011[3]
Accurate?

Configuration & options31

CBIT Board (1)[3]
Accurate?
DPS 16 (8)[3]
Accurate?
SPU 100 (7)[3]
Accurate?
APU 12 (15)[3]
Accurate?
QTMU (4)[3]
Accurate?
Rack[3]
Accurate?
DPS 16
8[4]
Accurate?
SPU 100
7[4]
Accurate?
APU 12
15[4]
Accurate?
QTMU
4[4]
Accurate?
CBIT Board
1[4]
Accurate?
DPS 16 modules
8[3]
Accurate?
SPU 100 modules
7[3]
Accurate?
APU 12 modules
15[3]
Accurate?
QTMU modules
4[3]
Accurate?
Component: CBIT Board
1 unit[3]
Accurate?
Component: DPS 16
8 units[3]
Accurate?
Component: SPU 100
7 units[3]
Accurate?
Component: APU 12
15 units[3]
Accurate?
Component: QTMU
4 units[3]
Accurate?
DPS 16 quantity
8[3]
Accurate?
SPU 100 quantity
7[3]
Accurate?
APU 12 quantity
15[3]
Accurate?
QTMU quantity
4[3]
Accurate?
Manufacturer
Teradyne / Eagle[3]
Accurate?
Model
ETS 88[3]
Accurate?
Tester designation
ETS-88[5]
Accurate?
Use
IC testing[5]
Accurate?
Use
Production board test[1]
Accurate?
Use
Isolator testing[6]
Accurate?
Vintage
2011[3]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What types of devices can be tested with this class of machine?General reference — not yet source-verified

Machines of this class are designed to test a broad variety of semiconductor devices, including digital, analog, mixed-signal, and power management ICs. The specific device types depend on the instrument configuration and the test head used.

How does the test system interface with a wafer prober?General reference — not yet source-verified

The test system connects to a wafer prober through a mechanical interface that aligns the probe card with the wafer. The test head provides electrical connections for all probes, and the prober steps the wafer under computer control while the tester applies signals and collects measurements from each die site.

What test capabilities does this class of equipment typically support?General reference — not yet source-verified

Typical capabilities include DC parametric measurement (voltage, current, resistance), functional logic testing, frequency and timing measurement, analog waveform generation and capture, and built-in self-test (BIST) support. Many systems also offer parallel test to increase throughput.

How is the test program developed for such a system?General reference — not yet source-verified

Test programs are created using the system's proprietary software environment, often with a graphical user interface for pattern generation, test flow definition, and limit setting. The program is compiled and loaded onto the tester, then debugged using simulation and dry-run modes before production use.

What are common maintenance considerations for this class of machine?General reference — not yet source-verified

Regular maintenance includes calibration of power supplies and measurement instruments, cleaning of probe card or socket interfaces, and periodic software updates. Downtime is minimized through preventive maintenance schedules and use of spare parts such as Pogo pins, cables, and cooling fans.

Not publicly documented

The following facts about the ETS 88 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the ETS 88 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the ETS 88 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the ETS 88 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the ETS 88 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the ETS 88 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (6)Every fact above is drawn from these public sources
  1. [1]web.archive.org — teradyne.com (May 5, 2026)web.archive.org
  2. [2]Inventory photo
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]patents.google.compatents.google.com
  6. [6]patents.google.compatents.google.com
Was this page accurate?

Last updated Oct 16, 2026.

Compare with similar tools

View all →