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Teradyne

Flex

Test & ProbeTeradyne Flex family
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Flex — Inventory photo
Fig. 01FlexInventory photo[1]
  • Plate 01Ultra Flex Stiffener Test Jig Side

    Found PacWatch on YouTube

What it is

General reference — not yet source-verified

The Teradyne Flex is a semiconductor test system. Semiconductor test systems apply electrical stimuli to devices and measure the responses to screen for functional faults and parametric failures before shipment or before later assembly stages.

How it works

General reference — not yet source-verified

Semiconductor testers generally connect a device under test to programmable instrument resources through interface hardware. Semiconductor testers generally execute test programs that force voltages, currents, timing patterns, and logic states, then compare measured results against pass and fail limits.

Modular semiconductor test systems generally organize measurement and stimulus resources in card or slot positions. Modular semiconductor test systems generally combine digital channels, power resources, and specialty instruments so a test program can address different pin groups and measurement tasks within one platform.

Where it fits in the process flow

General reference — not yet source-verified

Semiconductor test systems are used after fabrication has produced electrically testable devices and after packaging or probing has prepared those devices for contact. Semiconductor test systems sit between manufacturing steps and final shipment as a quality screen and data collection point.

A system designated as Test & Probe fits into electrical verification workflows for semiconductor devices. Probe-related use places the equipment around wafer-level contact operations, while tester use places the equipment around packaged-device electrical screening and characterization workflows.

Applications

General reference — not yet source-verified

Semiconductor testers are used for production screening, functional verification, and parametric measurement of integrated circuits and related electronic devices. Semiconductor testers are also used to support yield learning, guardband checks, and binning decisions based on electrical behavior.

What do the numbers mean?

Configuration & options23

26 Slots:[1]
Accurate?
Slot 1
BBAC-15 / 811-200-10[1]
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Slot 2
DC-90 XP / 805-229-61[1]
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Slot 3
DC-80 / 805-386-01[1]
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Slot 4
HVD-1 / 805-740-50[1]
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Slot 5
DC-90 XP / 805-229-61[1]
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Slot 7
MSB / 805-003-50[1]
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Slot 9
HSD-200 / 805-251-50[1]
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Slot 10
DC-90 XP / 805-229-61[1]
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Slot 11
HSD-200 / 805-251-50[1]
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Slot 12
DC-90 XP / 805-229-61[1]
Accurate?
Slot 13
DC-80 / 805-386-01[1]
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Slot 14
DC-90 XP / 805-229-61[1]
Accurate?
Slot 15
DC-80 / 805-386-01[1]
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Slot 16
HSD-200 / 805-251-50[1]
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Slot 17
HVD-1 / 805-740-50[1]
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Slot 18
POOL2 / 805-016-00[1]
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Slot 20
SSB / 805-003-11[1]
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Slot 22
HSD-200 / 805-251-50[1]
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Slot 25
DC-90 XP / 805-229-61[1]
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Product line
Flex[2]
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Slot count
26 slots[1]
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Slot 26
DC-80 / 805-386-01[1]
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Parts & consumables

Tracked replaceable assemblies, spares criticality, and availability status across all major subsystems. Each entry cites its source.

  • Teradyne Flex Pool 2 BoardIn Productionsource[3]
  • Teradyne Flex / BBAC BoardIn Productionsource[4]
  • Teradyne Flex / HDPMU BoardIn Productionsource[5]
  • Teradyne Flex / DC 30 BoardIn Productionsource[6]
  • Teradyne Flex / HSD 200 BoardIn Productionsource[7]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What is the Teradyne Flex Tester?

It is a Teradyne Flex test and probe system.[1]

Not publicly documented

The following facts about the Flex are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Flex are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Flex are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Flex are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Flex are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Flex is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (7)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]web.archive.org — teradyne.com (May 18, 2020)web.archive.org
  3. [3]Equipment inventory listing
  4. [4]Equipment inventory listing
  5. [5]Equipment inventory listing
  6. [6]Equipment inventory listing
  7. [7]Equipment inventory listing
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Last updated Oct 20, 2026.

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