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Tescan

S8000X

Metrology & InspectionTescan S8000X family
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The TESCAN S8000X is a FIB/SEM combining a plasma-source focused ion beam microscope and a high-resolution (BrightBeam) scanning electron microscope. The TESCAN S8000X uses a Xe+ ion plasma source capable of generating a focused beam up to 1 uA. The TESCAN S8000X includes a cryogenic stage and a sample transfer loadlock allowing work down to -160 C.[1]

TescanS8000X
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What it is

The Tescan S8000X is a FIB/SEM instrument for materials characterization. The Tescan S8000X combines a plasma-source focused ion beam microscope with a high-resolution BrightBeam scanning electron microscope. The Tescan S8000X is equipped with Time-of-Flight Secondary Ion Mass Spectrometry, an energy-dispersive X-ray spectrometer, a cryogenic stage, a sample transfer loadlock, and a cryogenic Kleindiek nanomanipulator.[1][2][3]

How it works

General reference — not yet source-verified

Focused ion beam and scanning electron microscope systems pair material removal with electron imaging in one chamber. Focused ion beams mill, section, or modify local regions of a specimen, while scanning electron microscopy images surface topography and contrast from the exposed area. Integrated chemical analysis can extend the platform from structural inspection into localized compositional investigation. Cryogenic handling on machines of this class supports work on temperature-sensitive or frozen specimens and helps preserve native structure during transfer and processing.

Where it fits in the process flow

The Tescan S8000X includes a cryogenic stage and a sample transfer loadlock that allow work down to -160 C or introduction of frozen samples for milling. The Tescan S8000X includes a cryogenic Kleindiek nanomanipulator that enables in-situ interaction with the sample and lift-out of frozen sections for subsequent TEM analysis.[1][2][3]

Applications

The Tescan S8000X is used for characterization of materials. The Tescan S8000X supports chemical characterization through ToF-SIMS and EDS. The Tescan S8000X is especially useful for detecting light elements, including discrimination of hydrogen and deuterium. The Tescan S8000X improves imaging of non-conducting samples through low-energy SEM performance.[1][2][3]

  • Materials characterization
  • Chemical characterization
  • Detecting light elements including discrimination of hydrogen and deuterium
  • Work with frozen samples
  • In-situ sample interaction
  • Lift-out of frozen sections for subsequent TEM analysis

What do the numbers mean?

Power & electrical1

Application
Electrical nanoprobing of sub-20 nm node technologies[4]
Accurate?

Vacuum & pumping5

Cryogenic capability
Cryogenic stage and sample transfer loadlock allowing work down to -160 C or introduction of frozen samples[1]
Accurate?
Nanomanipulator
Cryogenic Kleindiek nanomanipulator for in-situ interaction and lift-out of frozen sections for subsequent TEM analysis[1]
Accurate?
Cryogenic stage temperature range
down to -160 C[1]
Accurate?
Cryogenic capability
Cryogenic stage and sample transfer loadlock allowing work down to -160 C[3]
Accurate?
Nanomanipulator
Cryogenic Kleindiek nanomanipulator[3]
Accurate?

Wafer handling1

Wafer capability
SEM and FIB analyses of 8" wafers at any location are possible[4]
Accurate?

Optics & imaging4

Instrument type
Plasma-source focused ion beam microscope and high-resolution BrightBeam scanning electron microscope[1]2 sources
Accurate?
Electron microscope optics
Field-free, ultra-high resolution optics with improved low-energy imaging[1]
Accurate?
Electron source type
BrightBeam SEM, field-free, ultra-high resolution[1]
Accurate?
Application
Planar delayering of sub-20 nm node technologies[4]
Accurate?

Configuration & options10

Ion source
Xe+ ion plasma source[1]2 sources
Accurate?
Focused beam current
Up to 1 uA[1]2 sources
Accurate?
Milling rate
Up to 50X faster than prior Ga+ ion technology[1]
Accurate?
Analytical capability
Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)[1]
Accurate?
Analytical capability
Energy Dispersive x-ray spectrometer (EDS)[1]2 sources
Accurate?
Ion source type
Xe+ ion plasma source[1]
Accurate?
Maximum focused beam current
1 uA[1]
Accurate?
Analytical capabilities
ToF-SIMS and EDS[1]
Accurate?
Analytical capability
Time-of-Flight Secondary Ion Mass Spectrometery (ToF-SIMS)[2]
Accurate?
Application
Low-kV SEM inspection[4]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Cryogenic capabilityCryogenic stage and sample transfer loadlock allowing work down to -160 C or introduction of frozen samples[1]
  • NanomanipulatorCryogenic Kleindiek nanomanipulator for in-situ interaction and lift-out of frozen sections for subsequent TEM analysis[1]
  • Cryogenic stage temperature rangedown to -160 C[1]
  • Cryogenic capabilityCryogenic stage and sample transfer loadlock allowing work down to -160 C[3]
  • NanomanipulatorCryogenic Kleindiek nanomanipulator[3]
  • ApplicationElectrical nanoprobing of sub-20 nm node technologies[4]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What ion source does the Tescan S8000X use?

The Tescan S8000X uses a Xe+ ion plasma source in its focused ion beam column.[1][2][3]

What analytical techniques are integrated into the Tescan S8000X?

The Tescan S8000X integrates Time-of-Flight Secondary Ion Mass Spectrometry and an energy-dispersive X-ray spectrometer.[1][2][3]

What does the cryogenic nanomanipulator do on the Tescan S8000X?

The Tescan S8000X uses a cryogenic Kleindiek nanomanipulator for in-situ interaction with the sample and for lift-out of frozen sections for subsequent TEM analysis.[1][2][3]

Not publicly documented

The following facts about the S8000X are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the S8000X are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the S8000X are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the S8000X are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the S8000X are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the S8000X is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]nano.upenn.edu — nano.upenn.edunano.upenn.edu
  2. [2]wiki.nano.upenn.edu — wiki.nano.upenn.eduwiki.nano.upenn.edu
  3. [3]waferpedia.com — waferpedia.comwaferpedia.com
  4. [4]imagescience.huimagescience.hu
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Last updated Oct 20, 2026.

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