Ultratech
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A wafer stepper exposes a reticle image onto a wafer field, then advances the wafer to the next field and repeats the exposure. In this class of tool, the image is reduced optically during projection, and the exposure is used to define fine patterns in photoresist before later etch or deposition transfer steps.
The tool sits in the front end of wafer patterning, after resist coating and prior to development and downstream pattern transfer. It is used where repeated exposure of many identical chip sites across a wafer is required.
The Ultratech XLS 7800 is used for semiconductor lithography on 200 mm silicon wafers.[3]
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The following facts about the XLS 7800 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the XLS 7800 are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the XLS 7800 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the XLS 7800 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the XLS 7800 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the XLS 7800 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Jul 30, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.