Waferpedia

Ulvac

Ei 5

DepositionUlvac Ei 5 family
Research Quality: 50% complete
Email
Ei 5 — Inventory photo
Fig. 01Ei 5Inventory photo[1]
  • Plate 01Model:ei-5 バッチ式高真空蒸着装置 – 研究開発および少量生産に最適なソリューション

    アルバックテクノ株式会社Watch on YouTube
  • Plate 02Model:ei-5 拡張Item- 新型EBガン、クライオ改善Item、FABISEQのご紹介

    アルバックテクノ株式会社Watch on YouTube

Power

6 kW x 4 sets[2]

Vacuum

ULVAV CRYO-U16P+C30VR X1[1]

What it is

General reference — not yet source-verified

The Ulvac Ei 5 belongs to the deposition equipment class. Such systems are used to place a controlled layer of material onto a wafer, panel, mask, optic, or other prepared substrate so that the deposited film can serve an electrical, optical, chemical, magnetic, or protective function in a later process sequence.

How it works

General reference — not yet source-verified

Such systems usually emphasize control of chamber atmosphere, substrate handling, source delivery, energy input, and process timing so that film properties remain repeatable across the substrate and from run to run. Process development in this equipment class commonly focuses on film stress, density, adhesion, coverage, contamination control, stoichiometry, interface quality, and the interaction between the deposited layer and the underlying surface.

Applications

General reference — not yet source-verified

Machines of this class are generally used wherever engineered thin films are required. Typical applications include microelectronic layer formation, optical coatings, electrode and interconnect fabrication, diffusion or adhesion barrier formation, protective surface coatings, sensor structures, magnetic or functional materials deposition, and research or pilot-line process development involving controlled thin-film stacks.

What do the numbers mean?

Power & electrical3

EB source
ULVAC EGO-40M+Power supply EPS-1000F 10kW x1 set[1]
Accurate?
EB source
ULVAC EGL-406M+Power supply EPS-1000F x1 set[2]
Accurate?
Lamp heater
6 kW x 4 sets[2]
Accurate?

Vacuum & pumping3

Main vacuum pump
ULVAV CRYO-U16P+C30VR X1[1]
Accurate?
Assisted pump
Mechanical pump ULVAC EC803[1]
Accurate?
Vacuum gauge
ULVAC G-TRAN BMR2 ULVAC G-TRAN BRP2,SP1[1]
Accurate?

Wafer handling2

Substrate rotation
Revolving flat plate type[1]
Accurate?
Substrate heating
None[1]
Accurate?

Control & software1

Deposition controller
ULVAC CRTM-9000[1]
Accurate?

Configuration & options8

Resistance heating evaporation source
6.8kW 3 sets[1]
Accurate?
Deposition history
Au, PT, Ti[1]
Accurate?
Deposition history
Fe, Ni, Zn, Al2O3, Cr, Al, C, W[2]
Accurate?
Equipment type
Evaporator[1]
Accurate?
Make
Ulvac[1]
Accurate?
Model
Ei 5[1]
Accurate?
Vintage
2008[1]
Accurate?
Vintage
2009[2]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • EB sourceULVAC EGO-40M+Power supply EPS-1000F 10kW x1 set[1]
  • Main vacuum pumpULVAV CRYO-U16P+C30VR X1[1]
  • Assisted pumpMechanical pump ULVAC EC803[1]
  • Vacuum gaugeULVAC G-TRAN BMR2 ULVAC G-TRAN BRP2,SP1[1]
  • EB sourceULVAC EGL-406M+Power supply EPS-1000F x1 set[2]
  • Lamp heater6 kW x 4 sets[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What does a deposition system do?General reference — not yet source-verified

A deposition system forms a thin layer of material on a substrate surface under controlled process conditions. The resulting film can provide electrical conduction, insulation, optical behavior, chemical resistance, adhesion promotion, surface protection, or another engineered function.

What film attributes are usually important in deposition processes?General reference — not yet source-verified

Engineers commonly pay attention to thickness control, uniformity, composition, adhesion, coverage, stress, density, surface roughness, contamination level, and interface quality. The importance of each attribute depends on whether the layer serves an electrical, optical, structural, or protective role.

Where does deposition fit in a manufacturing flow?General reference — not yet source-verified

Deposition generally follows substrate preparation and precedes any later step that relies on the new layer. After deposition, the film may be patterned, etched, annealed, measured, stacked with additional layers, or sealed within a finished structure.

Not publicly documented

The following facts about the Ei 5 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Ei 5 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Ei 5 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Ei 5 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Ei 5 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the Ei 5 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]Inventory photo
Was this page accurate?

Last updated Oct 19, 2026.

Compare with similar tools

View all →