Ulvac
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An ion implanter forms an ion beam and directs that beam at a wafer surface to introduce dopant species into near-surface regions.
Ion implantation is used as a controlled doping step because beam energy and dose determine how many ions are delivered and how deeply they are placed in the wafer.
Ion implantation is a front-end doping process that follows pattern definition and precedes thermal steps that activate dopants and repair implantation damage.
Ion implantation is used to form regions with tailored electrical properties in integrated circuits.
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The following facts about the SOPHI 200 Ion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SOPHI 200 Ion are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SOPHI 200 Ion are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SOPHI 200 Ion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the SOPHI 200 Ion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the SOPHI 200 Ion is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 13, 2026.
The Varian 0216 7696, E 11368072 ESC is an electrostatic chuck (ESC) platen of the ADV-S type, categorized under ion implantation equipment.
The Varian 160 XP is an ion implanter. A variant, the Varian 160 XP Ion, is configured as a 150 mm high-current implanter.
The Varian 160 XP Ion is an ion implantation tool configured as a 150mm high-current implanter.