West Bond
7200 44 A 45 C Pick and Place Epoxy
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedPick and place epoxy die bonders handle singulated dies and place them onto package bases, substrates, or other mounting surfaces. Pick and place epoxy die bonders typically use an adhesive dispense or transfer step followed by die placement with controlled alignment and placement force. Die bonders of this class are used to create the mechanical and thermal attachment of the die before later interconnect and encapsulation steps.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding sits in semiconductor assembly after wafer processing and die separation, when individual chips are ready to be attached into a package or onto a substrate. Pick and place epoxy bonding normally comes before wire bonding or related interconnect formation, and before molding, sealing, or final assembly operations.
Applications
General reference — not yet source-verifiedPick and place epoxy die bonders are used in semiconductor packaging flows that require adhesive attachment of a die to a package element or substrate. Equipment in this class is applied where a process calls for accurate die placement prior to electrical interconnection and package completion.
What do the numbers mean?
Power & electrical4
Configuration & options3
- 50/60Cyc[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 7200 44 A 45 C Pick and Place Epoxy are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7200 44 A 45 C Pick and Place Epoxy are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7200 44 A 45 C Pick and Place Epoxy are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7200 44 A 45 C Pick and Place Epoxy are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7200 44 A 45 C Pick and Place Epoxy are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7200 44 A 45 C Pick and Place Epoxy is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]7200 44 A 45 C Pick and Place Epoxy — West Bond | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 15, 2026.
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