West Bond

wirebond2

Packaging & Bonding West Bond wirebond2 family

Research Quality: 40% complete

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wirebond2 — uwaterloo.ca — Fig. 01wirebond2uwaterloo.ca^[1]

Power

5 W, 63 kHz^[1]

Optics

look down camera and screen^[1]

What is it?

The equipment is identified as a West Bond wire bonder, model wirebond2, and is described as a semi-automatic wedge bond tool with microprocessor controllable motion in the Z and Y axes. It is used for making electrical contacts between semiconductor dies and packages, using ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages.

What can it run?

Process applications and technology nodes documented for this tool.

Making electrical contacts between semiconductor dies and packages

What do the numbers mean?

Power & electrical1

Transducer: 5 W, 63 kHz^[1]

Wafer handling1

Bonding method: uses ultrasonic energy to bond wire leads between wafer dies and contact pads of electronic packages^[1]

Optics & imaging1

Bond placement aid: look down camera and screen^[1]

Control & software2

Motion control: microprocessor controllable motion in Z and Y axes^[1]
Bonding control: programmable bonding steps for repeatable wire profile control^[1]

Configuration & options7

OEM: West Bond^[1]
Model: 4546E^[1]
Equipment type: semi-automatic wedge bond tool^[1]
Typical configured wire: 1 mil (25 μm) Al wire^[1]
Convertible wedge angle: 45° wedge and 90° (deep access) wedge bonding^[1]
Compatible wire materials and sizes: Al and Au wires from 0.7 mil to 2 mil in diameter for room temperature thermosonic bonding^[1]
Heated workholders: Multiple heated workholders available^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Transducer5 W, 63 kHz^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the wirebond2 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the wirebond2 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the wirebond2 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the wirebond2 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the wirebond2 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the wirebond2 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources

[1]uwaterloo.ca — uwaterloo.cauwaterloo.ca
[2]Packaging Lab | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca