ASM
AD 838 L alternatives
Comparable Packaging & Bonding equipment documented in the Waferpedia catalog.
6 comparable tools
Hybond
572 A 40 Thermosonic Wire & Ribbon
Packaging & Bonding
The Hybond 572 A 40 is a thermosonic wire and ribbon bonder with long-reach bonding, wire and ribbon capability, and a 6 x 8.5 inch work platform.
MRSI
HVM3
Packaging & Bonding
MRSI-HVM3 is a high-precision die bonding platform for high-volume production, described by MRSI as a 3-micron class system.
Kulicke & Soffa
IBond 5000
Packaging & Bonding
The Kulicke & Soffa IBond 5000 is a wire bonder with ball-wedge bonding capability.
Finetech
Lambda
Packaging & Bonding
Finetech Lambda is a die bonder with sub-micron placement accuracy, supporting thermocompression and ultrasonic bonding.
Applied Materials
0010-47763 ASSY ESC Bonded Monopolar Dual Heated
Packaging & Bonding
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
Applied Materials
0041-26723 Bonded Assembly
Packaging & Bonding
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
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