Applied Materials Mirra

Models in this family

1. 

   Mirra

   Applied Materials Mirra is a chemical mechanical planarization machine. Machines of this class are used to planarize wafer surfaces by combining controlled chemical action with mechanical polishing.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Applied Materials Mirra CMP	—	1999	Sources list configurations including Tungsten or Dielectric process use, software MP2B6.2_28 / MP2B6.2 28, three polish platens, and different polish head / flow controller descriptions.	Equipment inventory listing[1]
   Mirra	—	1999	—	Equipment inventory listing[1]
   Tungsten	—	1999	Listed with tungsten processing; one source also states 4 tungsten polish heads and one notes tungsten + polish heads.	Equipment inventory listing[1]
   Dielectric	—	1999	Listed with dielectric processing.	Equipment inventory listing[2]

2. 

   Mirra 3400

   The Applied Materials Mirra 3400 is a chemical mechanical planarization (CMP) system for 150 mm and 200 mm wafer processing.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   Mirra 3400 Stand-Alone	—	1996	Stand-alone configuration for Oxide/STI CMP, includes wet-in-wet-out handling and specific options such as TITAN1 UPA, DDF3 pad conditioner, and Windows NT control.	fabsurplus.com[3]

3. 

   Mirra 3600
4. Mirra Integra

   Applied Materials Mirra Integra is a CMP (Chemical Mechanical Polisher) for 8-inch wafers.

Sources