Applied Materials
Mirra
What it is
General reference — not yet source-verifiedThe Mirra is a CMP system, a class of semiconductor process equipment used to remove material from a wafer surface while reducing topography. Machines of this class are built around a rotating platen and a polishing head that hold the wafer against a consumable polishing surface.
Such systems are used to produce a flatter surface than can be obtained by deposition or etch steps alone. In microfabrication, planarization supports later patterning and interconnect formation by making the surface more uniform.
How it works
General reference — not yet source-verifiedA CMP machine works by pressing the wafer against a polishing pad while a slurry or other chemical process fluid is introduced at the interface. The pad motion, wafer motion, pressure, and chemistry act together to remove material from exposed regions of the surface.
The mechanical component provides controlled abrasion, while the chemical component helps soften or modify the surface material being removed. The combination allows the process to favor planarity and reduce surface nonuniformity across the wafer.
Where it fits in the process flow
General reference — not yet source-verifiedThis class of machine is typically used after deposition, oxidation, or other film-forming steps when a planar surface is needed before additional processing. It may also be used after fill or pattern-transfer steps that leave uneven topography.
Applications
General reference — not yet source-verifiedCMP machines are generally used for planarizing dielectric films, metal films, and other layered structures in semiconductor manufacturing. They are also used anywhere a controlled, flat surface is needed to support subsequent lithography, etch, or deposition steps.
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Known missing parts listed in one source: platen, hard drive, rotary union, 3 UPA regulators, and 2 UPA boards.
What do the numbers mean?
Wafer handling4
Control & software4
Configuration & options16
- 3 Polish Platens:[3]
- Platen1 - STD polish[3]
- Platen2 - STD Polish[3]
- 4 - Tungsten + Polish Heads[3]
- Entegris Flow Controllers[3]
- Upgrades:[3]
- Waterfall Cable[3]
- Remote UPA[3]
- Tungsten[1]
- Platen 1 - STD polish[1]
- Platen 2 - STD Polish[1]
- Waterfall Cable upgrade[1]
- Remote UPA upgrade[1]
- Dielectric[2]
- 4 Titan Polish Heads[2]
- McMillan Flow Controllers[2]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Applied Materials Mirra CMP | — | 1999 | Sources list configurations including Tungsten or Dielectric process use, software MP2B6.2_28 / MP2B6.2 28, three polish platens, and different polish head / flow controller descriptions. | Equipment inventory listing[3] |
| Mirra | — | 1999 | — | Equipment inventory listing[3] |
| Tungsten | — | 1999 | Listed with tungsten processing; one source also states 4 tungsten polish heads and one notes tungsten + polish heads. | Equipment inventory listing[3] |
| Dielectric | — | 1999 | Listed with dielectric processing. | Equipment inventory listing[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does a CMP machine do in semiconductor processing?General reference — not yet source-verified
It removes material from a wafer surface in a controlled way to make the surface flatter and more uniform.
Why combine chemistry and polishing in one process?General reference — not yet source-verified
The chemical action changes the surface so the mechanical polishing can remove material more effectively and with better planarity.
Where is CMP used in the process flow?General reference — not yet source-verified
It is used after steps that create films or topography, when the wafer needs to be leveled before later processing.
What kinds of materials are processed by this class of machine?General reference — not yet source-verified
Machines of this class are used on a range of wafer films, including dielectric and metal layers, depending on the process recipe.
What is the main result of CMP?General reference — not yet source-verified
The main result is a smoother, flatter wafer surface with reduced topography.
Not publicly documented
The following facts about the Mirra are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mirra are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Mirra are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the Mirra is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Mirra are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the Mirra are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]inventory listing
- [4]Equipment inventory listing
- [5]Applied Materials. About Applied Materials. What's New. — appliedmaterials.com (Mar 5, 2000)web.archive.org
Last updated Jul 30, 2026.
