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Applied Materials Reflexion

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  1. The Applied Materials Reflexion is a chemical mechanical polishing (CMP) system for 12-inch wafers.

    Cited variants

    DesignationGenerationVintageChangesSource
    Reflexion LK——listed as a CMP system available from Applied Materialspatents.google.com[1]
    Reflexion LK Prime——listed as a CMP system available from Applied Materialspatents.google.com[1]
    Reflexion——Configured as 12" Dielectric, LK Oxide.Equipment inventory listing[2]
  2. The Applied Materials Reflexion 3600 is a CMP (Chemical Mechanical Polisher).

  3. The Applied Materials Reflexion LK is a chemical mechanical planarization (CMP) system used for wafer surface planarization in semiconductor manufacturing.

All entries

  1. ReflexionApplied Materials

    The Applied Materials Reflexion is a chemical mechanical polishing (CMP) system for 12-inch wafers.

    CategoryCMP
    13 specs
  2. Reflexion 3600Applied Materials

    The Applied Materials Reflexion 3600 is a CMP (Chemical Mechanical Polisher).

    CategoryCMP
    27 specs
  3. Reflexion LKApplied Materials

    The Applied Materials Reflexion LK is a chemical mechanical planarization (CMP) system used for wafer surface planarization in semiconductor manufacturing.

    CategoryCMP
    12 specs

Sources

Sources (2)Every fact above is drawn from these public sources
  1. [1]patents.google.compatents.google.com
  2. [2]Equipment inventory listing