Tool family
The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.
The CEE 200 Spin is a spin coater with a 1 phase configuration and support for 8 inch wafers.
The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.
The CEE 200 Spin is a spin coater with a 1 phase configuration and support for 8 inch wafers.