CEE

The CEE 200CBX is a precision coat-bake system described as a track-quality spin coater with a high-uniformity bake plate.

The CEE 1000 Hot Plate is a thermal processing tool for 4-inch wafers.

The CEE 1100 FX Hot Plate is a hot plate with a maximum bake temperature of 300 degrees C, a substrate size range of 150 to 300 mm, and 240V 1Ph 60Hz power.

The CEE 100 CB is a spin coater/hot plate with a flow controller.

The CEE 200 Bake Plate is a bake plate for up to 200mm wafers with Internal OS software and 208V power.

The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.

The CEE 1300 X Hot Plate is a hot plate for 3, 4, 5, 6, and 8 inch wafers with vacuum and exhaust, programmable bake processing, lift pin, and contact, vacuum contact, nitrogen purge, and proximity modes.

The CEE 200XD is a develop spinner used in cleanroom lithography workflows.

The CEE 100CB is a spinner/hotplate for handling substrates from 1 cm² to 4-inch wafers and for use with standard positive photoresists only.

The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.

The CEE 100 is a spin coater with a listed power specification of 115 volts and 800 watts.

The CEE 1100 Hot Plate is a hot plate identified with 115V and 1725 watts.

The CEE 450 Spin Coater is a spin coater that handles up to 450mm round or 14"x14" square substrates and uses internal OS software.