CEE
200 Bake Plate
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
Wafer size
200mm
Power
208V[1]
What is it?
What do the numbers mean?
Power & electrical1
Wafer handling1
Control & software1
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- Voltage208V[1]
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- CEE X-Pro II Supplemental SOPSOPtamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 200 Bake Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 Bake Plate are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 200 Bake Plate are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 200 Bake Plate are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 200 Bake Plate are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 200 Bake Plate is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]CEE X-Pro II Supplemental SOP — aggiefab.tamu.eduaggiefab.tamu.edu
Last updated Jul 29, 2026.
Compare with similar tools
View all →
The YES 450PB is a high-temperature vacuum cure oven series for MEMS and semiconductor process applications, with related stainless-steel cassette accessories designed for the series.
The YES 8-2P-CP is a manual-load high-temperature cure oven in the PB Series, specified for 200 mm wafers.
