CEE
200 Bake Plate
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The CEE 200 Bake Plate is a bake plate for up to 200 mm wafers. The CEE 200 Bake Plate uses Internal OS software. The CEE 200 Bake Plate requires 208V power.[1][2][3][4]
What it is
General reference — not yet source-verifiedA bake plate is a heated substrate-processing station used in wafer fabrication and laboratory lithography flows. Bake plates are used to raise and hold substrate temperature in a controlled way for steps such as soft bake, post-apply bake, post-exposure bake, hard bake, and related thermal conditioning operations. Bake plates are commonly placed near coating and develop modules because they support resist processing between liquid application and later pattern-transfer steps.
How it works
The CEE 200 Bake Plate supports substrates up to 200 mm. The CEE 200 Bake Plate has a maximum temperature of 300 °C. The CEE 200 Bake Plate supports hard-contact baking, which holds a substrate with vacuum. The CEE 200 Bake Plate also supports proximity baking, which lifts a substrate 25 to 100 μm with nitrogen gas for slower temperature ramping of thick resists. The CEE 200 Bake Plate has an exhaust cover for fume removal. The CEE 200 Bake Plate uses smart pins for substrate temperature control.[5]
Where it fits in the process flow
The CEE 200 Bake Plate is part of a resist coating workstation that also includes spin coaters, an HMDS vapor primer, drainage sensors, automatic chemical supply for edge bead removal, backside rinse, and HMDS priming, plus a substrate cooling station.[5]
Applications
The CEE 200 Bake Plate is used for substrate baking within a lithography resists coating workstation. The CEE 200 Bake Plate supports bake methods suited to thick-resist processing because proximity mode allows slower temperature ramping.[5]
What do the numbers mean?
Power & electrical2
Vacuum & pumping1
Wafer handling2
Control & software2
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- CEE X-Pro II Supplemental SOPSOPtamu.edu
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What software does the CEE 200 Bake Plate use?
The CEE 200 Bake Plate uses an internal operating system.[1][2]
What bake methods are available on the CEE 200 Bake Plate?
The CEE 200 Bake Plate supports hard-contact baking with vacuum hold and proximity baking that lifts the substrate 25 to 100 μm with nitrogen gas for slower temperature ramping.[5]
Is the CEE 200 Bake Plate part of a larger workstation?
The CEE 200 Bake Plate is part of a resist coating workstation that includes spin coaters, an HMDS vapor primer, drainage sensors, automatic chemical supply for edge bead removal, backside rinse, and HMDS priming, plus a substrate cooling station.[5]
Not publicly documented
The following facts about the 200 Bake Plate are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 Bake Plate are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 200 Bake Plate are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 200 Bake Plate are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 200 Bake Plate are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 200 Bake Plate is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]200 Bake Plate — CEE | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [4]CEE 200 family | Waferpedia — waferpedia.comwaferpedia.com
- [5]aggiefab.tamu.edu — aggiefab.tamu.eduaggiefab.tamu.edu
Last updated Oct 20, 2026.
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