Esec
2100 HS
The Esec 2100 HS is a die bonder. The Esec 2100 HS supports epoxy die attach applications. The Esec 2100 HS is specified for wafer sizes from 4 inch to 12 inch on 8 inch or 12 inch wafer frames.[1]
Wafer size
8"
Power
208 - 230 VAC (@ 47 - 63 Hz), 800 - 1100VA[6]
Vacuum
Single time pressure dispense system[3]
Performance
20 µm[6]
What it is
General reference — not yet source-verifiedThe Esec 2100 HS is a die bonder used in semiconductor assembly and packaging.
How it works
Where it fits in the process flow
General reference — not yet source-verifiedThe Esec 2100 HS sits in back-end assembly after wafer fabrication and before later packaging or molding operations.
Applications
The Esec 2100 HS is used for epoxy die attach applications.[1]
What do the numbers mean?
Power & electrical1
Vacuum & pumping1
- Single time pressure dispense system[3]
Wafer handling4
Performance2
Dimensions & facilities4
Configuration & options12
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2100 hS iXplus | — | — | Latest innovation in the Esec Die Bonder 2100 i-family with continuous epoxy pattern writing technology, AI assisted vision inspection, and scalable 2100 i-family features. | besi.com[7] |
| Esec 2100 sD advanced i | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
| Esec 2100 hS i | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
| Esec 2100 SC Strip Mapping E142 on Esec Die Bonder | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
| Esec 2100 SSI E | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
| Esec 2009 SSI E | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
| Esec 2009 fS E | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
| Esec 2100 FC hS | — | — | Listed by Besi as a related die bonding model. | besi.com[1] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AD 838— Same function class: Packaging & Bonding, 8"Compare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2100 HS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 HS are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 HS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2100 HS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2100 HS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 HS are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]waferpedia.comwaferpedia.com
- [6]semiconductor.directorysemiconductor.directory
- [7]besi.com — besi.combesi.com
Last updated Oct 10, 2026.
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