Waferpedia

Tool family

EV Group 520

EV GroupPackaging & Bonding2 entries
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Models in this family

  1. 520

    The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

  2. 520 IS Wafer

    The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.

All entries

  1. 520EV Group

    The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

    CategoryPackaging & BondingWaferManual wafer load substrate bonder
    20 specs
  2. 520 IS WaferEV Group

    The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.

    CategoryPackaging & BondingWaferManual wafer load substrate bonder
    17 specs