EV Group 520

Models in this family

1. 

   520

   The EVG 520 is a manual wafer load substrate bonder with fusion, thermal compression, and anodic bonding capability.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   EVG520 IS	—	—	Semi-automated wafer bonding system with fully automated processing, manual loading/unloading, external cooling station, and compatibility with EVG mechanical and optical aligners.	evgroup.com[1]

2. 

   520 IS Wafer

   The EVG 520 IS Wafer is a manual wafer load substrate bonder with capabilities for fusion compression, thermal compression, and optional anodic bonding.

Sources