Waferpedia

Tool family

Heller 1809

Models in this family

  1. The Heller 1809 EXL is a forced convection reflow oven for soldering surface-mount components, featuring 9 top and 9 bottom heating zones, dual-zone active cooling, and temperature control accuracy of ±0.1°C, capable of handling board widths up to 23.5 inches.

  2. The Heller 1809 MK III SMT is a reflow oven for SMT soldering applications.

All entries

  1. 1809 EXLHeller

    The Heller 1809 EXL is a forced convection reflow oven for soldering surface-mount components, featuring 9 top and 9 bottom heating zones, dual-zone active cooling, and temperature control accuracy of ±0.1°C, capable of handling board widths up to 23.5 inches.

    CategoryThermal / Diffusion
    26 specs
  2. 1809 MK IIIHeller
    CategoryThermal / Diffusion
    8 specs
  3. 1809 MK III SMTHeller

    The Heller 1809 MK III SMT is a reflow oven for SMT soldering applications.

    CategoryThermal / Diffusion
    19 specs