1809 MK III SMT

The Heller 1809 MK III is a reflow oven designed for surface-mount technology (SMT) assembly. Heller Industries manufactured the 1809 MK III model. The 1809 MK III is a forced-convection reflow oven with nine heating zones and two cooling zones. The oven operates on 50/60 Hz and supports a standard 480 V three-phase power input, with optional voltages including 208/240/380/400/415 VAC. The 1809 MK III is available in both air and nitrogen atmosphere configurations.^{[1][2][4][5][6]}

The 1809 MK III reflow oven uses forced convection heating to transfer thermal energy to printed circuit boards (PCBs). The heater type is an instant-response open coil made of nichrome. Each of the nine heating zones has a wattage of 6000 W (at 480 V). The temperature controller has a control accuracy of ±0.1°C, and the cross-belt temperature tolerance is ±2.0°C. The standard temperature range is 60–350°C, with an optional high-temperature range up to 450°C. The heated tunnel length is 105 inches (254 cm). The conveyor system can be a mesh belt or an edge-hold conveyor. Maximum conveyor speed is 74 inches per minute (188 cm/min). The conveyor speed is controlled via a closed-loop system. The oven can store over 500 programs and 500 temperature curves and includes a five-channel thermocouple profiling capability.^[4][5][6]

The 1809 MK III includes a waterless cooling system with flux separation for the nitrogen version, and an optional nitrogen standby system. Typical nitrogen consumption is 500–700 SCFH depending on PPM, PCB size, and oven configuration. The oven can achieve a minimum PPM oxygen level of 10–25 PPM with optional hardware. The profile change time is 5–15 minutes. The oven is controlled by an AMD- or Intel-based computer running Windows 8 Home Premium, with a flat-screen monitor, auto-start software, data logging, and password protection. Optional features include a KIC profiler, GEM/SECS interfacing, and LAN networking.^[4][5][6]