Tool family
The Tokyo Electron Indy B L is a furnace used for thermal processing, including processes such as N2O, NH3, SiH2Cl2, SiH4 (PAC module), DCS Nitride, and D-Poly, with vintages from 2006 to 2010.
The Tokyo Electron Indy I L is a 12-inch furnace with source-listed vintage years of 2006 and 2007 in the provided records.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Indy I L (SEED Poly) | — | 2007 | SEED Poly process | Equipment inventory listing[2] |
| Indy I L (LT ALD SiN) | — | 2006 | LT ALD SiN process | Equipment inventory listing[3] |
| Indy I L (NH3/DCS/SiGe/C2H4/HF/N2/TiCl3) | — | 2006 | NH3, DCS, (SiGe), C2H4, HF with N2, TiCl3 Liquid process | Equipment inventory listing[4] |
Tokyo Electron Indy Plus is a deposition system. Machines of this class are used to form thin material films on semiconductor or precision substrates as part of controlled manufacturing workflows.
Cited variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Indy Plus ALD | — | 2009 | Described as ALD (Atomic Layer Deposition); one record describes it as Poly 2009 Vintage. | Equipment inventory listing[5] |
| Indy Plus Etcher | — | — | Described as an etcher. | Equipment inventory listing[6] |
| INDY PLUS BCD POLY | — | 2010 | Described as BCD POLY and listed with version 300 mm and vintage 01.07.2010. | fabsurplus.com[7] |
| Indy Plus-A-M | — | 2016 | Described as Low Temperature Nitride with wafer size 300 mm. | agsemiconductor.com[8] |
The Tokyo Electron Indy is a deposition tool, and one source identifies an Indy-B-L variant used for a HiK dielectric process.
The Tokyo Electron Indy B L is a furnace used for thermal processing, including processes such as N2O, NH3, SiH2Cl2, SiH4 (PAC module), DCS Nitride, and D-Poly, with vintages from 2006 to 2010.
The Tokyo Electron Indy I L is a 12-inch furnace with source-listed vintage years of 2006 and 2007 in the provided records.
General referenceTokyo Electron Indy Plus is a deposition system. Machines of this class are used to form thin material films on semiconductor or precision substrates as part of controlled manufacturing workflows.