Waferpedia

Tool family

Ulvac NE 950

UlvacEtch2 entries

Models in this family

  1. The Ulvac NE 950 EX ICP is an inductively coupled plasma etcher.

  2. The Ulvac NE 950 is an ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system with a chamber described for 2" to 12" wafers.

All entries

  1. NE 950 EX ICPUlvac

    The Ulvac NE 950 EX ICP is an inductively coupled plasma etcher.

    CategoryEtchWaferWafer end effector
    9 specs
  2. NE 950 ICP-RIEUlvac

    The Ulvac NE 950 is an ICP-RIE (Inductively Coupled Plasma - Reactive Ion Etch) system with a chamber described for 2" to 12" wafers.

    CategoryEtch
    20 specs