Accretech
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The Accretech UF 200 is an automatic wafer prober. The Accretech UF 200 supports 8-inch wafer sizes. The Accretech UF 200 is used for wafer testing and probing applications.[1][2]
An automatic wafer prober holds a wafer on a chuck and moves the wafer so each die can be brought into contact with the probe interface. A wafer prober repeats alignment, touchdown, electrical contact, and stepping across the wafer under automated control.
Wafer probers are used after wafer fabrication and before final packaging. Wafer probing supports die-level electrical screening so downstream assembly can use test results such as binning, rejection, or known-good-die selection.
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The following facts about the UF 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF 200 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UF 200 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UF 200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UF 200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the UF 200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 20, 2026.
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