Waferpedia

Accretech

UF3000 Fully Automated

AccretechUF3000 Fully Automated
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Performance

±2 microns[2]

Optics

Type6[1]

What it is

The Accretech (formerly Tokyo Semitsu Kogaku, TSK) UF3000 is a fully automatic wafer probing machine. The machine supports both 200 mm and 300 mm wafers on a single load port. The total alignment accuracy of the system is within ±2 μm. The UF3000 was developed as a standard model for semiconductor testing, suitable for both high-mix low-volume production and mass production.[2]

Where it fits in the process flow

The UF3000 is designed for integration into 300 mm wafer mass production lines. The machine is used for testing System LSI devices and memory products in both low-volume high-mix and high-volume production environments.[2]

Applications

The primary application of the UF3000 is semiconductor wafer testing, including parametric test, functional test, and wafer-level reliability (WLR) testing. The temperature-controlled chuck enables testing at elevated or reduced temperatures to evaluate device performance under various thermal conditions.[3][1]

What do the numbers mean?

Wafer handling6

-Loader Type
TSK[1]
Accurate?
-Chuck Temperature Range
30~150℃[1]
Accurate?
Wafer size support
200 mm (8") and 300 mm (12")[2]
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Maximum chuck temperature
200°C[3]
Accurate?
Minimum chuck temperature
-40°C[3]
Accurate?
Throughput rate
Up to 300 wafers per hour[3]
Accurate?

Optics & imaging1

-OCR Camera Type
Type6[1]
Accurate?

Performance2

Alignment accuracy
±2 microns[2]
Accurate?
Z-axis accuracy
±1 micron[3]
Accurate?

Control & software2

-Test System Interface
AL6050 & Focus3000[1]
Accurate?
Software version
S5.0FC4[1]
Accurate?

Configuration & options12

-Auto Card Change
Yes[1]
Accurate?
-Needle Cleaning Unit
150mm x 150mm Ceramics Pad[1]
Accurate?
-Manipulator
Hinge, MHF4000[1]
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Attachments
10 Files[1]
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Manufacturer
Accretech / TSK[1]
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Model
UF3000[1]
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Description
Fully Automated Prober[1]
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Version
300 mm[1]
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Vintage
01.05.2009[1]
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Probe card compatibility
Universal compatibility with various probe card types[3]
Accurate?
Includes
Printer[1]
Accurate?
S/W version
S5.0FC4[1]
Accurate?

Observed configurations

How individual machines were equipped when they appeared on the secondary market — as listed, per unit. These describe one specific machine, not the model in general.

Unit as listed[1]

  • Chuck temperature range 30~150°C
  • Nickel chuck 12 inch
  • Front 300 mm Single FOUP loading
  • Dual ceramic robot blade
  • s/w version S5.0FC4
  • Loader Type: TSK
  • OCR Camera Type: Type6
  • Auto Card Change: Yes
  • Needle Cleaning Unit: 150mm x 150mm Ceramics Pad
  • Manipulator: Hinge, MHF4000
  • Test System Interface: AL6050 & Focus3000
  • INCLUDES PRINTER
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What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What wafer sizes does the UF3000 support?

The UF3000 supports 200 mm and 300 mm wafers on one load port.[2]

Not publicly documented

The following facts about the UF3000 Fully Automated are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UF3000 Fully Automated are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the UF3000 Fully Automated are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the UF3000 Fully Automated are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the UF3000 Fully Automated are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the UF3000 Fully Automated is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingfabsurplus.com
  2. [2]prober.com — prober.comprober.com
  3. [3]junr.com.cn — junr.com.cnjunr.com.cn
  4. [4]Equipment inventory listing
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Last updated Oct 9, 2026.

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