Advantest
F 5112 E-Beam Lithography
The Advantest F 5112 is a single-column e-beam lithography system that offers an economical solution for 0.13-micron and below design rules. The Advantest F 5112 uses a 50 kV acceleration voltage and a variable shaped beam of 4 μm x 4 μm. The Advantest F 5112 achieves a minimum feature size of 100 nm and uses a block exposure method with overlay accuracy of |mean|+3 sigma <= 40 nm.[1][2]
What it is
General reference — not yet source-verifiedE-beam lithography systems write patterns into electron-sensitive resist by scanning a focused electron beam according to layout data. E-beam lithography systems are used when direct-write flexibility or very fine pattern definition is needed, and the equipment class serves lithography tasks without relying on a photomask during exposure.
How it works
The Advantest F 5112 uses an electron optical column equivalent to the column used in the previous F5121 twin-column system. The Advantest F 5112 combines a high-current column with a high-speed e-beam deflection system. The Advantest F 5112 uses a block exposure method that decreases the number of necessary exposure shots. The Advantest F 5112 offers a monitoring and feedback system for the exposure sequence. The Advantest F 5112 uses in situ cleaning of the electron optical column to maintain beam stability. The Advantest F 5112 has a maximum of 70 block patterns.[1]
Where it fits in the process flow
General reference — not yet source-verifiedE-beam lithography tools operate in the lithography portion of microfabrication after substrate preparation and resist coating and before resist development and pattern transfer. E-beam lithography tools are commonly used where direct-write patterning, mask making, device prototyping, or low-volume custom pattern generation is needed in a process flow.
Applications
General reference — not yet source-verifiedE-beam lithography systems are used for patterning fine features in resist for subsequent etch, lift-off, implantation, or deposition processes. E-beam lithography systems are also used in development environments where design changes are frequent and direct digital pattern generation is valuable.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
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Field notes
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Frequently asked questions
Not publicly documented
The following facts about the F 5112 E-Beam Lithography are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the F 5112 E-Beam Lithography are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the F 5112 E-Beam Lithography are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the F 5112 E-Beam Lithography are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the F 5112 E-Beam Lithography are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the F 5112 E-Beam Lithography is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Sources & citations
Sources (3)Every fact above is drawn from these public sources
- [1]web.archive.org — advantest.co.jp (Feb 5, 2012)web.archive.org
- [2]inventory listing
- [3]Inventory photo
Last updated Oct 17, 2026.
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