Applied Materials
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Produced
1995–
Power
50/60 Hz[1]
An etch system is semiconductor manufacturing equipment that removes selected material from a wafer after lithographic patterning. A plasma etcher transfers patterns by exposing the wafer to reactive species formed in a controlled process chamber.
The Applied Materials Centura 5200 DPS uses a decoupled plasma source architecture.[1]
Plasma etch equipment is used after a patterned resist or hard mask defines the areas to be opened on the wafer. Plasma etch equipment is followed by steps such as resist removal, cleaning, inspection, and the next deposition or implantation operation, depending on the device flow.
Plasma etch systems are used to pattern films that form device features and interconnect structures. Plasma etch systems are applied where anisotropic material removal and controlled feature transfer are required in semiconductor fabrication.
1995 vintage indicates production or introduction year.
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The following facts about the Centura 5200 DPS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the Centura 5200 DPS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura 5200 DPS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura 5200 DPS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Centura 5200 DPS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Centura 5200 DPS are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 17, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.