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Applied Materials

Centura II DPS Poly Dry

Etch
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

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What it is

The Applied Materials Centura II DPS Poly Dry Etch is a semiconductor dry etch cluster tool for poly etch applications.[1][2][3]

How it works

General reference — not yet source-verified

A dry etch cluster tool uses vacuum process chambers and plasma-based material removal to pattern films on semiconductor wafers.

A poly dry etch tool is used to remove polysilicon selectively in a fabrication sequence after mask definition and before later integration steps.

Where it fits in the process flow

General reference — not yet source-verified

The Centura II DPS Poly Dry Etch fits in the front-end wafer fabrication flow as a pattern-transfer tool for polysilicon features.

The Centura II DPS Poly Dry Etch follows lithographic patterning and precedes downstream cleaning, metrology, and subsequent layer processing.

Applications

The Centura II DPS Poly Dry Etch is used for polysilicon dry etch processing in semiconductor manufacturing.[1][2][3]

The Centura II DPS Poly Dry Etch is a cluster configuration with DPS process chambers.[2][3]

What do the numbers mean?

No specifications recorded yet

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What type of tool is the Centura II DPS Poly Dry Etch?

The Centura II DPS Poly Dry Etch is a poly dry etch cluster tool.[2][3][1]

What process is this tool intended for?

The Centura II DPS Poly Dry Etch is intended for poly dry etch processing.[1][2][3]

Not publicly documented

The following facts about the Centura II DPS Poly Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No specifications for the Centura II DPS Poly Dry are on record.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura II DPS Poly Dry are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Centura II DPS Poly Dry are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Centura II DPS Poly Dry are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Centura II DPS Poly Dry are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Applied Materials Centura II DPS POLY Dry Etch Cluster tool with 3 X DPS for salefabsurplus.comfabsurplus.com
  3. [3]Applied Materials Centura II DPS Poly Dry Etch Cluster tool with 3x DPS for salefabsurplus.comfabsurplus.com
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Last updated Aug 20, 2026.

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