Applied Materials
Provisional entry — research in progress
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A dry etch cluster tool uses vacuum process chambers and plasma-based material removal to pattern films on semiconductor wafers.
A poly dry etch tool is used to remove polysilicon selectively in a fabrication sequence after mask definition and before later integration steps.
The Centura II DPS Poly Dry Etch fits in the front-end wafer fabrication flow as a pattern-transfer tool for polysilicon features.
The Centura II DPS Poly Dry Etch follows lithographic patterning and precedes downstream cleaning, metrology, and subsequent layer processing.
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The following facts about the Centura II DPS Poly Dry are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the Centura II DPS Poly Dry are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Centura II DPS Poly Dry are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Centura II DPS Poly Dry are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Centura II DPS Poly Dry are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Centura II DPS Poly Dry are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Aug 20, 2026.