Applied Materials

Mirra Mesa CMP 5201

CMP Wafer loss sensor Applied Materials Mirra Mesa family

Research Quality: 30% complete

The Applied Materials Mirra Mesa CMP 5201 is an 8-inch wafer polisher for oxide processing with dry-in/dry-out cassette handling. The Mirra Mesa CMP 5201 includes three 20-inch HCLU platens, four 8-inch polish heads, and a wafer loss sensor.^[1]

Mirra Mesa CMP 5201 — Inventory photo — Fig. 01Mirra Mesa CMP 5201Inventory photo^[1]

Wafer size

Wafer loss sensor

Gas delivery

Dual line output type delivery (3)^[1]

What is it?

The Applied Materials Mirra Mesa CMP 5201 is a CMP polisher for 8-inch wafers with oxide, dry-in/dry-out configuration.

What do the numbers mean?

Vacuum & pumping1

Polish head vacuum: Membrane vacuum ±10%, upgraded vacuum eject system^[1]

Wafer handling11

Open type cassette / 4 ports^[1]
Cassette: 25 slots^[1]; Cassette Wet Q-Tank^[1]
Cross Arm: side to side on robot plate, 270±0.1*^[1]
Wafer size: Wafer loss sensor^[1]
Wafer size: Dual wafer loss sensor with Temp monitoring (4)^[1]
Wafer size: 8 inch^[1]
Cassette type: Open type cassette / 4 ports^[1]
Cassette capacity: 25 slots^[1]
Wafer loss sensor: Present^[1]
Dual wafer loss sensor with temp monitoring: Present (4)^[1]

Gas & chemistry1

Slurry arm: Dual line output type delivery (3)^[1]

Control & software2

Temperature control^[1]
Platen temperature control: Present^[1]

Configuration & options31

Oxide, W^[1]; Dry In / Dry Out^[1]
Tower Lamp: 4 colors^[1]; Cross pedestal assy^[1]
Motor: Yaskawa^[1]; HCLU^[1]; Platen:^[1]; 20" (3)^[1]
Motor: Yaskawa (3)^[1]; Speed 1,2,3 ±5%(10~150rpm)^[1]; ISRM module type (3)^[1]; Upper platen teflon coating (3)^[1]; Polish Head:^[1]
OEM: Applied Materials^[1]
Model: Mirra Mesa CMP 5201^[1]
Equipment type: Polisher^[1]
Process configuration: Oxide, Dry In / Dry Out^[1]
HCLU platen size: 20 inch (3)^[1]
Platen motor: Yaskawa (3)^[1]
Platen speed: 1,2,3 ±5% (10–150 rpm)^[1]
ISRM module type: Present (3)^[1]
Upper platen coating: Teflon coating (3)^[1]
Polish head size: 8 inch (4)^[1]
Polish head rotation motor: NSK motor (4)^[1]
Polish head speed: ±5% (10–120 rpm)^[1]
Polish head action: Programmable & auto action for heads 1–4^[1]
Water fall type: Configured^[1]
Rotary union: 3 port / zone type^[1]
Head sweep: Standard head sweep, oriental motor^[1]
Pad conditioner: 1 per platen (3), screw type, universal disk holder^[1]
Polisher lower: Malema flow meter type (6)^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Polish head vacuumMembrane vacuum ±10%, upgraded vacuum eject system^[1]
Slurry armDual line output type delivery (3)^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the Mirra Mesa CMP 5201 process?

The Mirra Mesa CMP 5201 processes 8-inch wafers.^[1]

What type of CMP process is the Mirra Mesa CMP 5201 configured for?

The tool is configured for oxide CMP.^[1]

Does the Mirra Mesa CMP 5201 include temperature control and wafer loss detection?

Yes, the system includes temperature control and dual wafer loss sensors with temperature monitoring on the platens.^[1]

Not publicly documented

The following facts about the Mirra Mesa CMP 5201 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mirra Mesa CMP 5201 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Mirra Mesa CMP 5201 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Mirra Mesa CMP 5201 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Mirra Mesa CMP 5201 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Mirra Mesa CMP 5201 is not on record.
Answerable by: an OEM datasheet or a fab qualification report