Applied Materials

Mirra Mesa CMP 5201

CMP Wafer loss sensor Applied Materials Mirra Mesa family

Research Quality: 50% complete

The Applied Materials Mirra Mesa CMP 5201 is an 8-inch wafer polisher for oxide processing with dry-in/dry-out cassette handling. The Mirra Mesa CMP 5201 includes three 20-inch HCLU platens, four 8-inch polish heads, and a wafer loss sensor.^[1]

Mirra Mesa CMP 5201 — Inventory photo — Fig. 01Mirra Mesa CMP 5201Inventory photo^[1]

Wafer size

Wafer loss sensor

Gas delivery

Dual line output type delivery (3)^[1]

What it is

General reference — not yet source-verified

CMP tools perform chemical mechanical planarization on semiconductor wafers. CMP combines pad contact, controlled mechanical motion, and process slurry to remove material and reduce topography. CMP systems are used to create flatter wafer surfaces for later patterning, deposition, and interconnect steps.

How it works

General reference — not yet source-verified

CMP systems press a wafer carrier against a moving polishing pad while slurry is delivered to the polishing interface. CMP systems control relative motion, pressure zoning, slurry flow, and conditioning so that material removal remains uniform across the wafer. CMP systems also use sensors and handling automation to detect wafer presence and move wafers between carriers and cassettes.

Where it fits in the process flow

General reference — not yet source-verified

CMP tools are used after film formation and pattern definition steps when wafer topography must be reduced before later processing. CMP commonly fits between deposition or fill operations and subsequent lithography, etch, or metallization steps. CMP helps prepare surfaces for tighter depth of focus control and more uniform downstream processing.

Applications

The Applied Materials Mirra Mesa CMP 5201 is configured for oxide and W polishing on 8 inch wafers.^[1]

What do the numbers mean?

Vacuum & pumping1

Polish head vacuum: Membrane vacuum ±10%, upgraded vacuum eject system^[1]

Wafer handling15

Open type cassette / 4 ports^[1]
Cassette: 25 slots^[1]; Cassette Wet Q-Tank^[1]
Cross Arm: side to side on robot plate, 270±0.1*^[1]
Wafer size: Wafer loss sensor^[1]
Wafer size: Dual wafer loss sensor with Temp monitoring (4)^[1]
Wafer size: 8 inch^[1]
Cassette type: Open type cassette / 4 ports^[1]
Cassette capacity: 25 slots^[1]
Wafer loss sensor: Present^[1]
Dual wafer loss sensor with temp monitoring: Present (4)^[1]
Wafer size: Wafer head 1,2,3,4, programable & auto action^[1]
Wafer sizes: 8 inch^[1]
Wafer handling: Dry in / Dry out^[1]
Wafer loss sensor: Included^[1]

Gas & chemistry1

Slurry arm: Dual line output type delivery (3)^[1]

Control & software3

Temperature control^[1]
Platen temperature control: Present^[1]
Temperature control: Included^[1]

Configuration & options34

Oxide, W^[1]; Dry In / Dry Out^[1]
Tower Lamp: 4 colors^[1]; Cross pedestal assy^[1]
Motor: Yaskawa^[1]; HCLU^[1]; Platen:^[1]; 20" (3)^[1]
Motor: Yaskawa (3)^[1]; Speed 1,2,3 ±5%(10~150rpm)^[1]; ISRM module type (3)^[1]; Upper platen teflon coating (3)^[1]; Polish Head:^[1]
OEM: Applied Materials^[1]
Model: Mirra Mesa CMP 5201^[1]
Equipment type: Polisher^[1]
Process configuration: Oxide, Dry In / Dry Out^[1]
HCLU platen size: 20 inch (3)^[1]
Platen motor: Yaskawa (3)^[1]
Platen speed: 1,2,3 ±5% (10–150 rpm)^[1]
ISRM module type: Present (3)^[1]
Upper platen coating: Teflon coating (3)^[1]
Polish head size: 8 inch (4)^[1]
Polish head rotation motor: NSK motor (4)^[1]
Polish head speed: ±5% (10–120 rpm)^[1]
Polish head action: Programmable & auto action for heads 1–4^[1]
Water fall type: Configured^[1]
Rotary union: 3 port / zone type^[1]
Head sweep: Standard head sweep, oriental motor^[1]
Pad conditioner: 1 per platen (3), screw type, universal disk holder^[1]
Polisher lower: Malema flow meter type (6)^[1]
Rotation motor: NSK motor (4)^[1]
Head 1,2,3,4 speed: ±5%(10~120 rpm)^[1]
Process: Oxide^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Polish head vacuumMembrane vacuum ±10%, upgraded vacuum eject system^[1]
Slurry armDual line output type delivery (3)^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the Applied Materials Mirra Mesa CMP 5201 support?

The Applied Materials Mirra Mesa CMP 5201 is configured for 8 inch wafers.^[1]

Not publicly documented

The following facts about the Mirra Mesa CMP 5201 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Mirra Mesa CMP 5201 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Mirra Mesa CMP 5201 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Mirra Mesa CMP 5201 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Mirra Mesa CMP 5201 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Mirra Mesa CMP 5201 is not on record.
Answerable by: an OEM datasheet or a fab qualification report