ASML
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The ASML PAS 5500/850 D is a scanner for 6-inch wafers, using a Cymer ELS-6610 light source and supporting R type, 1.2 mm notch and flat wafers.[1]

The ASML PAS 5500/850 D is a deep ultraviolet (DUV) step-and-scan lithography system (scanner) used in semiconductor manufacturing. The system supports 6-inch wafers and accommodates R-type substrates with a thickness of 1.2 mm, in both notch and flat configurations. The system includes an Athena alignment system and is equipped with a Cymer ELS-6610 laser source.[1]
In a DUV scanner, a laser source generates deep ultraviolet light that is directed through a beam delivery system and illumination optics to uniformly illuminate the reticle. The reticle pattern is then projected through a high-resolution reduction lens onto the wafer, which is coated with photoresist. The wafer stage and reticle stage move synchronously during exposure to scan the entire field. Alignment sensors, such as the Athena system, measure wafer position and correct for overlay errors.
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The system supports 6-inch wafers.[1]
The system is equipped with a Cymer ELS-6610 laser source.[1]
The system processes R-type substrates with a thickness of 1.2 mm, including both notch and flat wafer orientations.[1]
The PAS 5500/850 D is a scanner (step-and-scan system).[1]
The following facts about the PAS 5500 850 D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAS 5500 850 D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the PAS 5500 850 D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the PAS 5500 850 D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the PAS 5500 850 D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the PAS 5500 850 D is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Aug 18, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.