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ASML

PAS 5500 850 D

LithographyASML PAS 5500 family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The ASML PAS 5500/850 D is a scanner for 6-inch wafers, using a Cymer ELS-6610 light source and supporting R type, 1.2 mm notch and flat wafers.[1]

PAS 5500 850 D — Inventory photo
Fig. 01PAS 5500 850 DInventory photo[1]

What it is

The ASML PAS 5500/850 D is a deep ultraviolet (DUV) step-and-scan lithography system (scanner) used in semiconductor manufacturing. The system supports 6-inch wafers and accommodates R-type substrates with a thickness of 1.2 mm, in both notch and flat configurations. The system includes an Athena alignment system and is equipped with a Cymer ELS-6610 laser source.[1]

How it works

General reference — not yet source-verified

In a DUV scanner, a laser source generates deep ultraviolet light that is directed through a beam delivery system and illumination optics to uniformly illuminate the reticle. The reticle pattern is then projected through a high-resolution reduction lens onto the wafer, which is coated with photoresist. The wafer stage and reticle stage move synchronously during exposure to scan the entire field. Alignment sensors, such as the Athena system, measure wafer position and correct for overlay errors.

What do the numbers mean?

Wafer handling2

Substrates
R type, 1.2 mm Notch and flat wafers[1]
Accurate?
Wafer size
6 inch[1]
Accurate?

Configuration & options4

Athena[1]
Accurate?
Cymer ELS-6610[1]
Accurate?
Light source
Cymer ELS-6610[1]
Accurate?
Athena
Athena[1]
Accurate?
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the ASML PAS 5500/850 D support?

The system supports 6-inch wafers.[1]

What laser source is installed in the PAS 5500/850 D?

The system is equipped with a Cymer ELS-6610 laser source.[1]

What substrate types can the PAS 5500/850 D process?

The system processes R-type substrates with a thickness of 1.2 mm, including both notch and flat wafer orientations.[1]

Is the PAS 5500/850 D a stepper or a scanner?

The PAS 5500/850 D is a scanner (step-and-scan system).[1]

Not publicly documented

The following facts about the PAS 5500 850 D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the PAS 5500 850 D are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the PAS 5500 850 D are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the PAS 5500 850 D are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the PAS 5500 850 D are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the PAS 5500 850 D is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (2)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]ASML: Products - PAS 5500/1150Casml.com (Jun 9, 2015)web.archive.org
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Last updated Aug 18, 2026.

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