ASML
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASML YieldStar S 1375 F is an overlay measurement system that processes 12-inch wafers.[1]
Overlay measurement systems for semiconductor manufacturing often employ diffraction-based overlay (DBO) technology. The systems measure overlay error by analyzing the diffraction pattern from a periodic target. Multiple wavelengths of light are used to extract information from different depths and materials.
The measurement process involves illuminating a dedicated overlay target on the wafer and collecting the diffracted light. The collected signals are processed to determine the misregistration between the layers with high precision.
The overlay measurement system is used after the photoresist development step in the lithography process. The measurement results are fed back to the lithography scanner to adjust the alignment for subsequent wafers. The system also provides data for process control before the wafer undergoes etching.
Overlay metrology is a key step in the lithography cycle. The measurements are used to monitor and correct overlay errors, which directly affect the electrical performance of the device. The system is typically integrated into the fab's automation and data management systems.
The system is employed across various technology nodes, including advanced logic, memory, and other integrated circuits. The high-precision measurements enable tight overlay budgets required for sub-wavelength lithography.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The following facts about the YieldStar S 1375 F Overlay Measurement are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the YieldStar S 1375 F Overlay Measurement are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the YieldStar S 1375 F Overlay Measurement are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the YieldStar S 1375 F Overlay Measurement are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the YieldStar S 1375 F Overlay Measurement are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the YieldStar S 1375 F Overlay Measurement are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Last updated Sep 1, 2026.
The KLA .204 PSL Wafer is an 8-inch NIST-traceable reference wafer compatible with Surfscan 6xy0 and Sp1 particle counters.
KLA .496 PSL Wafer is an 8-inch NIST traceable wafer stated to be capable on Surfscan 6xy0 and SP1.
The KLA 0035235-003 MMD Head is a TSTD PCB ASSY, MMD MEAS HEAD compatible with the KLA AIT-XP.