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Blue M

200

Thermal / DiffusionBlue M 200 family
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This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Blue M 200 oven is used for oven bake applications, providing a temperature range from 200 °C to 437 °C. The Blue M 200 is used for high-temperature bakes such as polyimide curing.[1][2]

Blue M200
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What it is

The BlueM 200 is an oven bake system used in semiconductor fabrication. The BlueM oven is for 200°C to 437°C temperature bakes, i.e. polyimide.[1][2]

Where it fits in the process flow

The BlueM 200 is classified under the resist bake step in the photolithography process sequence. Photolithography involves coating substrates with photoresist, exposing the resist to light, and then developing the pattern; bake steps are interleaved to drive out solvents and thermally stabilize the resist. The BlueM oven is used for higher-temperature bakes such as those required for polyimide curing, which occur after resist coating and potentially after other processing steps.[1][2]

What do the numbers mean?

Configuration & options1

Temperature range
200°C to 437°C[1]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What is the BlueM 200 used for?

The BlueM 200 is used for temperature bakes such as polyimide curing.[1][2]

In which step of photolithography is the BlueM 200 used?

The BlueM 200 is used in the resist bake step of photolithography.[1][2]

Not publicly documented

The following facts about the 200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the 200 are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 200 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 200 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 200 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 200 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]snfguide.stanford.edu — snfguide.stanford.edusnfguide.stanford.edu
  2. [2]Photolithography | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
  3. [3]Equipment Name Table | Stanford Nanofabrication Facility — snfguide.stanford.edusnfguide.stanford.edu
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Last updated Oct 9, 2026.

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