APD1

The Logitech APD1 is a precision annular and peripheral saw. The Logitech APD1 is designed for slicing wafers, crystals, or semiconductor components up to 55 mm in diameter, and for precision dicing of wafers up to 100 mm in diameter. The Logitech APD1 combines annular and peripheral cutting in a single unit. The Logitech APD1 is intended to cut and slice specimens accurately and thinly with minimal surface damage and kerf loss.^[1][3]

The Logitech APD1 supports automatic or manual operation, including programmed repeated cuts to selected thicknesses and diameters. The Logitech APD1 is operated by setting parameters such as cut depth, cut thickness, and number of cuts. The Logitech APD1 uses an intelligent joystick control panel and a graphical interface screen. In annular cutting mode, the cutting edge is the diamond-coated central aperture of a fine steel disc held under tension at its outer edge. The Logitech APD1 can be changed from annular to peripheral configuration. A manually operated rotary table with variable height is available for peripheral cutting, and an automated format with joystick-controlled Z-axis is also available. The Logitech APD1 tables provide an indexing facility for cuts at known angles to each other.^[1][3]

Precision saws of this class sit in sample preparation and substrate preparation flows where bulk material must be divided into wafers, coupons, bars, or die with controlled damage. In semiconductor-related work, such tools can be used near the front of the materials flow for slicing material from a boule, or later for sectioning finished or partly processed parts for singulation, analysis, or downstream thinning and polishing.

Precision annular and peripheral saws are used across semiconductor, optics, optoelectronics, and laboratory sample preparation work. Such machines are chosen for brittle or hard materials that need low-damage sectioning before later lapping, polishing, bonding, inspection, or microscopy steps.