Disco

DFG 841 Grinder Lapper

CMP Robot Unit– automated wafer handling between cassettes and chuck tables.Disco DFG 841 family

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DFG 841 Grinder Lapper — Inventory photo — Fig. 01DFG 841 Grinder LapperInventory photo^[1]

Wafer size

Robot Unit– automated wafer handling between cassettes and chuck tables.

Power

AC 200V, 50/60 Hz, 3-Phase, 17 kVA^[1]

Vacuum

Two chuck tables(porous vacuum type).^[1]

What is it?

The Disco DFG 841 is a grinder/lapper/polisher for 8-inch wafers with automated wafer handling and two porous-vacuum chuck tables.

What do the numbers mean?

Power & electrical3

Power: AC 200V, 50/60 Hz, 3-Phase, 17 kVA^[1]; Transformer (20 kVA, Tokyo Sanyo Denki) – converts facility power (208–415 V input → 200 V output).^[1]; Electrical Compartment– control and power distribution^[1]

Vacuum & pumping2

Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).^[1]

Accurate?

Two chuck tables(porous vacuum type).^[1]

Accurate?

Wafer handling5

Grinding Method: In-feed grinding with wafer rotation^[1]
Accuracy: Planarity ≤ 1.5 µm across wafer^[1]
Wafer size: Robot Unit– automated wafer handling between cassettes and chuck tables.^[1]; Automatic cassette loading/unloading with same-cassette return.^[1]
Wafer size: Wafer thickness measurement(contact gauge system).^[1]

Control & software1

with HDD and Software^[1]

Accurate?

Dimensions & facilities1

Cooling Water: 0.2 MPa (2 kgf/cm²), 11 L/min^[1]

Configuration & options6

Spindle Speed (Max): 7,000 rpm^[1]
Air Requirement: 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)^[1]
Cutting Water: 0.2 MPa (2 kgf/cm²), 15 L/min^[1]; Chiller Unit– stabilizes grinding fluid temperature.^[1]; Filter Unit– for grinding water/coolant circulation.^[1]
Spindle options: Configurable for coarse + fine grind^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

PowerAC 200V, 50/60 Hz, 3-Phase, 17 kVA^[1]
ConfigurationVacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).^[1]
ConfigurationTransformer (20 kVA, Tokyo Sanyo Denki) – converts facility power (208–415 V input → 200 V output).^[1]
ConfigurationElectrical Compartment– control and power distribution^[1]
ConfigurationTwo chuck tables(porous vacuum type).^[1]

Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the DFG 841 Grinder Lapper are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFG 841 Grinder Lapper are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFG 841 Grinder Lapper are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFG 841 Grinder Lapper are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFG 841 Grinder Lapper are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFG 841 Grinder Lapper is not on record.
Answerable by: an OEM datasheet or a fab qualification report