Waferpedia

Tool family

EV Group 850

Models in this family

  1. The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

  2. The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

  3. The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

All entries

  1. 850 DebonderEV Group
    CategoryPackaging & Bonding
    2 specs
  2. 850 LTEV Group

    The EVG 850 LT is an 8-inch bonder with wafer ID reader, prebond, IR inspection, plasma activation, and automated handling features.

    CategoryPackaging & BondingWaferWafer ID Reader
    20 specs
  3. 850 LT SOI Fusion WaferEV Group

    The EV Group 850 LT SOI Fusion Wafer Bonder is a fully automatic wafer bonder configured for 8-inch/200mm wafers.

    CategoryPackaging & BondingWafer200mm
    13 specs
  4. 850 SOI WaferEV Group

    The EVG 850 SOI Wafer Bonder is a fully automatic wafer bonder suitable for wafer sizes up to 6 inch/150mm and currently configured for 6 inch/150mm wafers.

    CategoryPackaging & BondingWafer150mm
    11 specs
  5. 850 TBLEV Group
    CategoryPackaging & Bonding
    1 spec
  6. 850 WaferEV Group
    CategoryPackaging & Bonding
    6 specs