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Heller

1936 MK 5

Thermal / DiffusionHeller 1936 MK 5 family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Heller 1936 MK 5 is a reflow oven. The Heller 1936 MK 5 uses forced hot air convection. The Heller 1936 MK 5 has 10 top modules and 10 bottom modules.[1][2][3]

1936 MK 5 — Inventory photo
Fig. 011936 MK 5Inventory photo[1]

Power

9.2 - 14.6 kW[3]

Gas delivery

Air, Nitrogen, Formic Acid, forming gas[4]

What it is

General reference — not yet source-verified

Reflow ovens are thermal processing machines used after solder paste printing and component placement to heat electronic assemblies through a controlled temperature profile. Reflow ovens transport assemblies through heated sections and cooling sections so solder joints can form without manual soldering.

How it works

General reference — not yet source-verified

Reflow ovens heat assemblies in successive thermal regions that commonly include preheat, soak, reflow, and cooling. Convection reflow ovens circulate heated process gas around the product while a conveyor carries the assembly through the thermal tunnel. In inert operation, a controlled low oxygen atmosphere helps limit oxidation during soldering.

Where it fits in the process flow

General reference — not yet source-verified

Reflow ovens sit in the electronics assembly flow after solder paste deposition and component placement. Reflow ovens are followed by inspection, test, and any downstream assembly or cleaning operations required by the product build.

Applications

General reference — not yet source-verified

Reflow ovens are used to melt solder paste and form permanent electrical and mechanical interconnections on populated circuit assemblies. Reflow ovens are also used in processes that need controlled thermal ramps, peak temperature exposure, and managed cooling to protect components and achieve consistent joint formation.

What do the numbers mean?

Power & electrical2

Typical power consumption
9.2 - 14.6 kW[3]
Accurate?
Typical power consumptions
9.2 - 14.6 kW[3]
Accurate?

Gas & chemistry1

Process gas options
Air, Nitrogen, Formic Acid, forming gas[4]
Accurate?

Dimensions & facilities1

Dimensions
589 x 150 x 160 mm[3]
Accurate?

Configuration & options15

With Net Belt[1]
Accurate?
10 zones[1]
Accurate?
Model
1936 MK 5[1]
Accurate?
Type
Reflow Oven[1]
Accurate?
Heating zones
10 top modules, 10 bottom modules[2]
Accurate?
Cooling zones
3 cooling zones[2]
Accurate?
Convection type
Forced hot air convection[2]
Accurate?
Maximum conveyor speed
188 cm/min[2]2 sources
Accurate?
Heating length
360 cm[3]
Accurate?
Max board size
350 mm (L) x 350 mm (W) x 29 mm (H)[4]
Accurate?
Make
Heller[1]
Accurate?
Heating modules
10 top modules, 10 bottom modules[2]
Accurate?
Heating technology
Forced hot air convection[2]
Accurate?
Standard PCB size
508 mm[2]
Accurate?
Heating zones
10 Top, 10 Bottom[3]
Accurate?

Vintage & configurations

Documented models & variants

DesignationGenerationVintageChangesSource
1936MK5-F——Formic reflow oven variant.web.archive.org[5]
1936MK5-VR——Voidless vacuum reflow oven variant.hellerindustries.com[4]
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Typical power consumption9.2 - 14.6 kW[3]
  • Process gas optionsAir, Nitrogen, Formic Acid, forming gas[4]
  • Typical power consumptions9.2 - 14.6 kW[3]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

Why is atmosphere control important in this class of equipment?General reference — not yet source-verified

The surrounding gas environment affects surface chemistry, oxidation behavior, contamination risk, and reaction pathways during heating. Machines of this class therefore manage gas delivery and exhaust so the thermal step proceeds under the intended conditions.

Is this class only for semiconductor diffusion?General reference — not yet source-verified

No. While diffusion is one important use, the same general class also supports broader thermal treatments wherever controlled heat and atmosphere are required to change material structure, remove residuals, improve films, or stabilize earlier process steps.

Not publicly documented

The following facts about the 1936 MK 5 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1936 MK 5 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • The control-system platform and OS era of the 1936 MK 5 are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 1936 MK 5 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 1936 MK 5 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 1936 MK 5 are on record.

    Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]efsmt.com — efsmt.comefsmt.com
  3. [3]amtest-smt.com — amtest-smt.comamtest-smt.com
  4. [4]hellerindustries.com — hellerindustries.comhellerindustries.com
  5. [5]web.archive.org — hellerindustries.com (Apr 17, 2026)web.archive.org
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Last updated Oct 18, 2026.

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