Heller

788

Research Quality: 40% complete

788 — web.archive.org — Fig. 01788web.archive.org^[1]

What is it?

The Heller 788 is described as an in-line, continuous cure, vertical format oven for curing applications. The source states that it conveys product from the assembly line onto rails inside the oven, with four internal thermal zones, independent time and temperature controls, clean room compatibility, and operation in air or nitrogen atmospheres.

What can it run?

Process applications and technology nodes documented for this tool.

die attach
flip chip underfill
COB encapsulation
epoxy cure

What do the numbers mean?

Wafer handling2

pitch between product carriers: 3/8 to 1 1/2 inches (9.5 to 38 mm) in 3/8-inch (9.5 mm) increments^[1]
interface: magazine loader interface^[1]

Control & software1

software: Windows software^[1]

Dimensions & facilities3

footprint: as small as 72 inches (183 cm)^[1]
product width range: 2 to 18 inches (5 to 46 cm)^[1]
conveyor width adjustability: adjustable from 2 to 18 inches (5 to 46 cm)^[1]

Configuration & options11

oven type: in-line, continuous cure, vertical format oven^[1]
thermal zones: four internal thermal zones^[1]
controls: independent time and temperature controls^[1]
cycle time: as short as 25 seconds^[1]
curing time: from a few minutes to several hours^[1]
product thickness range: as thin as 0.015 inch (0.4 mm)^[1]
atmosphere: air or nitrogen^[1]
clean room compatibility: Class 1,000 or 10,000 clean room compatibility^[1]
board support: center board support for ultra-thin boards^[1]
heating: forced convection heating^[1]
standards: SMEMA compatibility; meets CE standards^[1]

Interested in this tool?

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 788 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 788 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 788 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 788 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 788 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 788 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources

[1]web.archive.org — web.archive.orgweb.archive.org
[2]web.archive.org — web.archive.orgweb.archive.org
[3]Heller 788 Vertical Format Oven — semiconductoronline.comsemiconductoronline.com
[4]Vertical Curing Oven - Heller 788 — smtnet.comsmtnet.com