Hitachi
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The Hitachi Kokusai DD 802 V H is a semiconductor manufacturing machine in the thermal and diffusion category.
A thermal diffusion furnace is used to heat wafers in a controlled process environment so atoms can move into or through the surface of the semiconductor substrate.
A machine in this class is generally used for heat-driven wafer processes such as dopant diffusion and related thermal treatments that depend on uniform temperature control and process-gas management.
A diffusion furnace sits in the wafer fabrication flow after patterning steps that define where material modification is needed.
A diffusion furnace is used before later electrical completion steps that depend on the thermal formation of regions in the wafer.
Thermal diffusion equipment is used for semiconductor wafer processing tasks that require controlled high-temperature exposure.
Thermal diffusion equipment is used for dopant introduction and other heat-based substrate treatments in mature-node semiconductor manufacturing.
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The following facts about the Kokusai DD 802 V H are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Kokusai DD 802 V H are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Kokusai DD 802 V H are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Kokusai DD 802 V H are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Kokusai DD 802 V H are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Kokusai DD 802 V H is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 12, 2026.
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