Kokusai DJ 1209 VC DMM

Chemical vapor deposition equipment forms thin films on wafer surfaces by introducing reactive process gases into a controlled chamber and driving surface reactions that leave a deposited layer. Deposition tools of this class are used in semiconductor manufacturing to add functional or protective films as part of device fabrication.

Chemical vapor deposition systems operate by exposing wafers to process gases under controlled thermal and pressure conditions so that a solid film forms on the wafer surface. Deposition tools in this class generally integrate a process chamber, gas delivery, exhaust handling, and wafer handling to support repeatable film formation.

Chemical vapor deposition tools are used during film formation stages of wafer fabrication after surface preparation and before later patterning, etch, implantation, or metallization steps, depending on the layer being built. Deposition systems of this class fit into process flows wherever a conformal or blanket thin film must be added to the wafer stack.

Chemical vapor deposition equipment is applied to the formation of dielectric, passivation, barrier, and other thin-film layers used in integrated device structures. Deposition tools of this class are used when a process requires controlled film coverage across patterned or unpatterned wafer surfaces.