Hitachi
M 712 M 711 Dry Etch Process
The Hitachi M 712 / M 711 Dry Etch Process is an etch system for 12-inch wafers. The Hitachi M 712 / M 711 Dry Etch Process can be configured with a bipolar ESC and a Hitachi EPD monitor for endpoint detection. The Hitachi M 712 / M 711 Dry Etch Process includes a gas panel and supports a range of process gases.[1][2]
What it is
How it works
The Hitachi M 712 / M 711 Dry Etch Process uses an electrostatic chuck with a bipolar type, an endpoint monitor, an EC source generator, an EC bias generator, and an EC TMP controller.[2]
Where it fits in the process flow
General reference — not yet source-verifiedDry etch equipment sits in the pattern-transfer portion of the fab flow, where it works after lithographic patterning and before later device finishing steps.
The Hitachi M 712 / M 711 Dry Etch Process belongs in a wafer-etch process module rather than in deposition, metrology, or inspection.
Applications
General reference — not yet source-verifiedDry etch chambers are used for plasma-based pattern transfer on semiconductor wafers.
What do the numbers mean?
Power & electrical6
Wafer handling1
Gas & chemistry4
Control & software4
- 3203LMC-K1 EC TMP Controller[2]
Configuration & options19
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| M 712 / M 711 | — | 2006–2006 | Variant with gas configuration and ESC type Bipolar | Equipment inventory listing[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationDAIHEN ES7-IIA EC Source generator[2]
- ConfigurationPEARL CF-500-400K EC Bias generator[2]
- ConfigurationGas configuration:[2]
- Source generatorDAIHEN ES7-IIA EC Source generator[2]
- Bias generatorPEARL CF-500-400K EC Bias generator[2]
- Gas configurationLine / EC1 / Strip - 1 / Ar - 2 / C12 - 3 / SF6 - 4 / HBr - 5 / CF3 - 6 / CH4 - 7 / NF3 - 8 / O2 - 9 / N2 - 10/ SF6 - 11/ C12 - 12/ O2[2]
- Gas panel includedYes[1]
- Gas panelIncluded[1]
- EC source generatorDAIHEN ES7-IIA[2]
- EC bias generatorPEARL CF-500-400K[2]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What materials can a dry etch system of this class process?General reference — not yet source-verified
Such systems can etch a range of materials used in semiconductor fabrication, including silicon, silicon dioxide, silicon nitride, metals, and other thin films, depending on the process chemistry and chamber configuration.
What is the difference between dry etching and wet etching?General reference — not yet source-verified
Wet etching uses liquid chemicals and is typically isotropic, while dry etching uses plasma and can produce highly directional, anisotropic profiles. Dry etching offers better pattern transfer fidelity for fine geometries and is preferred for critical layers in integrated circuit manufacturing.
Not publicly documented
The following facts about the M 712 M 711 Dry Etch Process are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the M 712 M 711 Dry Etch Process are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the M 712 M 711 Dry Etch Process are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the M 712 M 711 Dry Etch Process are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the M 712 M 711 Dry Etch Process is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the M 712 M 711 Dry Etch Process are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
Last updated Oct 13, 2026.
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