Waferpedia

Hitachi

M 9010 XST

EtchHitachi M 9010 XST family
Research Quality: 40% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Hitachi M 9010 XST is an etcher for polysilicon processing. The Hitachi M 9010 XST handles 12-inch wafers.[1]

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What it is

The Hitachi M 9010 XST is an etcher used in semiconductor manufacturing.[1]

The M 9010 XST model is configured for polysilicon etching.[1]

How it works

General reference — not yet source-verified

Etchers in this class remove material from a wafer surface using plasma or reactive gases to transfer a pattern defined by a previous lithography step.

Polysilicon etchers typically employ a radio-frequency (RF) plasma to generate reactive species that chemically attack and remove silicon from exposed areas while maintaining selectivity to underlying layers.

Where it fits in the process flow

General reference — not yet source-verified

A polysilicon etcher is used after lithographic patterning of the gate layer in CMOS transistor fabrication.

The etching step removes polysilicon from areas not protected by photoresist, defining the transistor gate electrodes.

Applications

General reference — not yet source-verified

The primary application of a polysilicon etcher is gate electrode definition in logic and memory devices.

Polysilicon etching is also used in the formation of poly resistors and poly-poly capacitor structures.

What do the numbers mean?

Wafer handling1

Wafer Sizes
12 inch[1]
Accurate?

Configuration & options2

Polysilicon[1]
Accurate?
Application
Polysilicon[1]
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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What wafer size does the Hitachi M 9010 XST support?

The Hitachi M 9010 XST supports 12-inch wafers.[1]

What material does the Hitachi M 9010 XST etch?

The Hitachi M 9010 XST is designated for polysilicon etching.[1]

Not publicly documented

The following facts about the M 9010 XST are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the M 9010 XST are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the M 9010 XST are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the M 9010 XST are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the M 9010 XST are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the M 9010 XST is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]inventory listing
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Last updated Aug 20, 2026.

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