RS 800 II

A reflow oven heats assemblies in a controlled thermal profile so solder paste can melt and then solidify into electrical and mechanical joints. Reflow ovens are used after component placement and before downstream inspection, test, and subsequent assembly handling.

The Juki RS 800 II uses full-convection heating. The Juki RS 800 II has 8 top heating zones and 8 bottom heating zones. The Juki RS 800 II has a total heated length of 3110 mm. The Juki RS 800 II has 2 top cooling zones with a total cooling length of 800 mm. The Juki RS 800 II supports a temperature setting range from ambient to 300 degrees in the standard configuration, with an optional range from ambient to 350 degrees in reflow zones. The Juki RS 800 II has a warming time to production ready of 30 minutes.^[3]

The Juki RS 800 II transports product through the oven on a conveyor system. The Juki RS 800 II is available with a mesh conveyor in 18 inch or 24 inch width configurations. The Juki RS 800 II also supports an edge rail. The RS800-II conveyor width range is 50 mm to 460 mm, with a 610 mm conveyor option. The RS800-II conveyor adjustment method is motorized. The RS800-II conveyor direction is left to right. The RS800-II conveyor speed range is 300 mm to 2000 mm per minute. The RS800-II includes a front fixed rail, a pin and chain conveyor, and wire mesh transport.^[1][2][3]

A reflow oven sits in an electronics assembly flow after solder paste deposition and component placement. A reflow oven is followed by inspection, rework if needed, and electrical test or higher-level assembly operations.

Reflow ovens are used to process printed circuit board assemblies carrying solder paste and placed components. Reflow ovens are applied where controlled heating and cooling are needed to create solder joints for surface-mount assembly.