KLA
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The KLA 4PP-TypeF is a 4-point probe. The KLA 4PP-TypeF is listed on the KLA Instruments product page.[1]

The 4PP-TypeF features a probe spacing of 0.625 mm, a tip radius of 40 µm, and a contact force rating of 100 grams. The probe is specifically designed for metal measurement applications. The 4PP-TypeF is compatible with Filmetrics R50 and R54 four-point probe measurement systems.[2][3]
Sheet resistance measurements are performed after thin-film deposition steps such as metal sputtering, evaporation, or chemical vapor deposition. The measurement verifies the resistivity and uniformity of the deposited layer. In semiconductor manufacturing, four-point probes are used for process monitoring and quality control of metal interconnects and other conductive films.
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Two-point probe measurements apply current and measure voltage through the same pair of probes, so contact resistance can severely affect accuracy. Four-point probes separate the current and voltage paths, allowing voltage to be measured with a high-impedance voltmeter that draws negligible current, thereby eliminating the influence of contact and lead resistances from the measurement.
When the sample thickness is less than about half the probe spacing, the measured resistance depends on both sheet resistance and thickness. Correction factors are applied to account for finite thickness. For thick samples (more than several probe spacings), the bulk resistivity can be computed directly. Many modern systems automatically determine the appropriate correction based on user-input thickness or known geometry.
Regular maintenance includes cleaning or replacing probe tips as they become worn or contaminated, verifying probe spacing alignment, and calibrating the current source and voltmeter. Probe tip force should be checked periodically to ensure consistent contact without damaging the sample. Environmental conditions such as temperature and humidity can also affect readings, so some systems require periodic recalibration.
Yes, but care must be taken because the probes contact small areas that may include multiple material layers or structures. The measurement will represent the sheet resistance of the area under the probes, which may not be uniform. Some systems offer micro-probe heads with very small tip spacing for measuring within small test structures. Measurements on patterned wafers are often used for process monitoring rather than absolute resistivity determination.
The following facts about the 4PP-TypeF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 4PP-TypeF are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 4PP-TypeF are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 4PP-TypeF are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 4PP-TypeF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 4PP-TypeF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 8, 2026.