Lam Research
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During operation, the ESC secures the wafer within a vacuum chamber. An electrostatic force clamps the wafer in place, and the chuck can be biased to influence the energy and direction of ions formed in the plasma.
The electrostatic chuck is a key component within the etch module of a semiconductor fabrication line. Wafers are loaded onto the chuck, undergo plasma etching, and are then unloaded for subsequent steps.
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The following facts about the 839 800327 315 ESC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 839 800327 315 ESC are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 839 800327 315 ESC are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 839 800327 315 ESC are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 839 800327 315 ESC are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 839 800327 315 ESC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 12, 2026.
The Applied Materials 0010-47763 is an electrostatic chuck (ESC) assembly used in semiconductor etching processes.
The Applied Materials 0010-16392 is an electrostatic chuck assembly designed for 300 mm wafer processing, featuring a dual electrode configuration.
Oxford Instruments 100 ICP Fluorine is an inductively coupled plasma etcher for fluorine-based etching, supporting cryo DRIE and multiple etch gases including SF6 and C4F8.