Lam Research

Concept Two

Deposition Lam Research Concept Two family

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Concept Two — Inventory photo — Fig. 01Concept TwoInventory photo^[1]

What it is

General reference — not yet source-verified

The Lam Research Concept Two is a semiconductor deposition tool family used for thin-film processing in fabrication lines.

How it works

The Concept Two CVD configuration includes a degas chamber, a Damaclean etch module, a TA PVD chamber, two CU HCM PVD chambers, a CVD TiSiN chamber, and an orienter.^[1]^[4]

The Concept Two PECVD configuration uses QNX 3.x as the operating system.^[3]^[4]

Applications

General reference — not yet source-verified

Deposition tools are used to form insulating, barrier, conductive, or specialty thin films on wafers.

What do the numbers mean?

Wafer handling1

Wafer size: 8 inch^[1]

Gas & chemistry3

Gas: TEOS, SiH4, N2O, NH3^[3]
Process type: PECVD (Plasma-Enhanced Chemical Vapor Deposition)^[3]
Process type: CVD (Chemical Vapor Deposition)^[1]

Control & software1

Control system OS: QNX 3.x^[3]

Configuration & options9

Dual Sequel TEOS, Non Shrink^[3]
OS: QNX 3.x^[3]; 1 Degas chamber^[1]; 1 Damaclean etch module^[1]; 1 TA PVD Chamber^[1]; 1 CU HCM PVD Chamber^[1]; 1 CVD TI SIN Chamber^[1]; 1 Orienter^[1]
Chambers and modules: 1 Degas chamber; 1 Damaclean etch module; 1 TA PVD Chamber; 1 CU HCM PVD Chamber; 1 CVD TI SIN Chamber; 1 Orienter^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

GasTEOS, SiH4, N2O, NH3^[3]
Process typePECVD (Plasma-Enhanced Chemical Vapor Deposition)^[3]
Process typeCVD (Chemical Vapor Deposition)^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What process type is the Concept Two used for?

The Concept Two is used for chemical vapor deposition and plasma-enhanced chemical vapor deposition configurations.^[1]^[3]^[4]^[5]

Not publicly documented

The following facts about the Concept Two are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept Two are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Concept Two are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Concept Two are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept Two are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept Two is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (5)Every fact above is drawn from these public sources

[1]Inventory photo
[2]Inventory photo
[3]inventory listing
[4]Concept Two — Lam Research | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
[5]Lam Research Concept Two family | Waferpedia — waferpedia.comwaferpedia.com