Lam Research
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The Lam Research Rainbow 4420 is a multi-process etch system designed for eight-inch wafers.[1]
Rainbow-series etchers typically use a parallel-plate reactor configuration with radio-frequency power applied to one electrode to generate a plasma.
The system operates in reactive ion etching mode, where ions from the plasma bombard the wafer surface to enable anisotropic etch profiles.
The system is used for etching dielectric materials such as silicon dioxide and silicon nitride.
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The following facts about the Rainbow 4420 Multi-Process are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Rainbow 4420 Multi-Process are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Rainbow 4420 Multi-Process are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Rainbow 4420 Multi-Process are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Rainbow 4420 Multi-Process are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Rainbow 4420 Multi-Process is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Sep 1, 2026.