Lam Research
TCP 9600
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedPlasma etch systems remove selected thin-film material from wafer surfaces after a patterned mask has been formed. Etch tools of this class are used to transfer lithographic patterns into underlying layers with gas-phase chemistries and controlled ion bombardment.
How it works
General reference — not yet source-verifiedTransformer-coupled plasma etchers generate plasma above the wafer and use radio-frequency power to sustain reactive species for anisotropic material removal. Etchers in this class commonly combine chemical reaction with directional ion assistance so that patterned openings in resist can be transferred into underlying films. Load-locked single-wafer architectures are commonly used to isolate the process chamber from ambient exposure between wafers.
Where it fits in the process flow
General reference — not yet source-verifiedMetal etch systems operate after lithography has defined the pattern to be transferred into a conductive film. Metal etch systems are used before downstream strip and cleaning steps that remove resist residue and post-etch byproducts.
Applications
General reference — not yet source-verifiedMetal etchers are used to pattern conductive layers that form interconnects and related structures on semiconductor wafers. Tools in this class are commonly applied where a resist image must be transferred into deposited metal films with controlled profile and minimal damage to surrounding material.
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- System typeSingle-wafer, vacuum load-locked low pressure metal etch system[4]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the TCP 9600 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TCP 9600 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TCP 9600 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TCP 9600 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TCP 9600 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TCP 9600 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Equipment inventory listing
- [3]waferpedia.comwaferpedia.com
- [4]semigroup.comsemigroup.com
Last updated Oct 20, 2026.
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