LTX-Credence

Automatic test equipment systems are semiconductor test platforms used to apply electrical stimuli to devices and measure the resulting responses. Automatic test equipment systems are used to verify device behavior against test limits during manufacturing and product qualification. Test and probe configurations commonly interface with handling or probing hardware so packaged devices or wafers can be presented to the tester in a controlled sequence.
Automatic test equipment systems route programmed signals from installed instrument resources to the device under test and evaluate measured outputs against pass or fail criteria. Automatic test equipment systems typically combine stimulus generation, voltage and current sourcing, measurement functions, timing resources, and switching paths within a configurable chassis. Test and probe installations commonly use docking hardware to connect the tester to external manipulation or device presentation hardware.
Automatic test equipment sits in the electrical test portion of semiconductor manufacturing rather than in wafer fabrication patterning or deposition steps. Automatic test equipment can be used after wafer processing during wafer sort with probe interface hardware, and it can also be used later for packaged-device test with suitable handling equipment. Automatic test equipment generally follows device fabrication and packaging preparation, and it precedes shipment qualification and binning decisions.
Automatic test equipment is used for electrical characterization, production screening, and functional verification of semiconductor devices. Automatic test equipment supports measurement tasks such as applying signals, sourcing or sensing electrical conditions, and checking whether device responses remain within required limits. Test and probe setups are used where a test program must be executed repeatedly across many devices with controlled contact to package leads or wafer pads.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
No research found yet — worked with this tool? Share what you know.
The LTX-Credence X-Series LX 20 is an automatic test equipment system.[1]
The LTX-Credence X-Series LX 20 was configured with docking and a manipulator from Turbodynamics.[1]
The following facts about the X-Series LX 20 ATE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the X-Series LX 20 ATE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the X-Series LX 20 ATE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the X-Series LX 20 ATE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the X-Series LX 20 ATE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the X-Series LX 20 ATE is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 19, 2026.
The Tenney TPS JR-A-F4T is a junior compact temperature test chamber with a 1.2 cubic foot chamber size and a temperature range of -68°C to +180°C.
The Rorze 03 RR 8120-001-001 is a wafer exchanger for 8-inch wafers.
The KLA 1007 is a wafer prober manufactured by KLA.