Waferpedia

Mattson

Aspen II ICP LE

Etch
Research Quality: 30% complete

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

MattsonAspen II ICP LE
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What it is

General reference — not yet source-verified

The Mattson Aspen II ICP LE is an inductively coupled plasma low-energy etch system designed for semiconductor wafer processing.

How it works

General reference — not yet source-verified

Inductively coupled plasma etchers generate a high-density plasma using a radio-frequency coil wrapped around a dielectric chamber, producing a reactive ion etch with independent control of ion energy.

Where it fits in the process flow

General reference — not yet source-verified

Etch systems of this class remove material from defined areas on the wafer to create features such as contact holes, vias, or trenches, and are preceded by lithography and followed by cleaning and inspection.

What do the numbers mean?

Wafer handling1

Wafer Size
8 inch[1]
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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the Aspen II ICP LE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • Fewer than 3 independently cited specifications for the Aspen II ICP LE are on record; the remainder await public documentation.

    Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Aspen II ICP LE are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the Aspen II ICP LE are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the Aspen II ICP LE are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the Aspen II ICP LE are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

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Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
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Last updated Aug 20, 2026.

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