Nikon

A lithography scanner exposes the wafer through a patterned reticle with precision motion control between the projection optics, wafer stage, and alignment systems. In this class, the tool repeatedly aligns, exposes, and steps fields across the wafer to create the desired image pattern in photoresist.
As a scanner in the exposure cell, it is used where pattern definition must be repeated across many fields on a wafer. In a production flow, that places it near alignment and exposure operations rather than bulk material deposition or final test.
Lithography scanners of this class are used to form circuit patterns for integrated circuits and other microfabricated devices on coated wafers. They support pattern transfer for production layers that require repeated field exposure and overlay control.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Scanner | — | 2001 | Listed with software version MCSV, CIM SECS, handler system WL Type 3, factory interface Open Cassette, and Cymer ELS 6400 laser. | Equipment inventory listing[2] |
| Stepper / Scanner | — | 2001 | Listed with WL size 200MM, reticle size 6", RL type Standard (no smif), NEMA box 3P 200V, chamber Sendai, lens type 4EN2GK, and Cymer ELS 6400 laser. | Equipment inventory listing[6] |
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It is used for photolithography.[1][2]
The following facts about the NSR S 204 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSR S 204 B are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the NSR S 204 B are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSR S 204 B are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the NSR S 204 B is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the NSR S 204 B are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.