Ontrak
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The Ontrak DSS 200 is a double-sided PVA scrubber for cleaning wafers from 100mm to 200mm. The Ontrak DSS 200 is used for post-CMP cleaning, general cleaning, and silicon cleaning applications.[1][2][3]
The Ontrak DSS 200 features a double-sided PVA scrub with dual brush boxes, ammonia dispense, and an IR-assisted spin dry station. The system includes a universal load station (Series 1) or a 200mm ergonomic load station (Series 2), a robotic unload, a vertical unload station, and touchscreen controls. The Series 2 adds dark plastic covers to protect light-sensitive wafers.[1][2]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| DSS 200 Series 1 | — | — | Base variant; double-sided PVA scrubber for 100-200mm wafers. | axustech.com[1] |
| DSS 200 Series 2 | — | — | Offers throughput of 45-65 wafers per hour, dark plastic covers to protect light-sensitive wafers. | axustech.com[2] |
| DSS 200 Series 2 CE | — | — | Cleaning method: brush scrub; brush type: roller PVA; downforce control: yes; edge scrub: optional; megasonic: optional; drying: spin + heat lamp; NH4OH: yes; dHF: no; SC-1 pre-diluted: yes; SC-2: citric-based; backside chemical: yes; metal CMP cleans: yes; STI CMP cleans: yes; double contained process area: no. | entrepix.com[3] |
| DSS 200 Synergy | — | — | Cleaning method: brush scrub; brush type: roller PVA; downforce control: yes; edge scrub: optional; megasonic: optional; drying: spin + heat lamp; NH4OH: yes; dHF: yes; SC-1 pre-diluted: yes; SC-2: citric OR HCL-based; backside chemical: yes; metal CMP cleans: yes; STI CMP cleans: yes; double contained process area: yes. | entrepix.com[3] |
| DSS 200 Integra | — | — | Cleaning method: brush scrub; brush type: roller PVA; downforce control: yes; edge scrub: optional; megasonic: optional; drying: spin + heat lamp; NH4OH: yes; dHF: yes; SC-1 pre-diluted: yes; SC-2: citric OR HCL-based; backside chemical: yes; metal CMP cleans: yes; STI CMP cleans: yes; double contained process area: yes; integrated megasonic. | entrepix.com[3] |
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The Ontrak DSS 200 is designed to clean wafers from 100mm to 200mm in diameter.[1][3]
Depending on the application, throughputs of 45-65 waers per hour are attainable.[2]
The Ontrak DSS 200 uses double-sided PVA brush scrubing with ammonia disense and an IR-assisted spin dry station for drying.[1][2]
The Series 2 configuration includes dark plastic covers to protect light-sensitive wafers.[2]
The following facts about the DSS 200 Integrated Circuit are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DSS 200 Integrated Circuit are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the DSS 200 Integrated Circuit are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DSS 200 Integrated Circuit are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DSS 200 Integrated Circuit is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the DSS 200 Integrated Circuit are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Aug 14, 2026.
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