Oxford Instruments
80 Plus
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Oxford 80 Plus is a plasma-enhanced chemical vapor deposition system used for thin-film deposition in semiconductor and microfabrication workflows.[1][2][3][4]
How it works
General reference — not yet source-verifiedAs a class, PECVD tools are used in thin-film vacuum processing to create functional dielectric and passivation layers, while related dry-etch tools use plasma chemistry to remove selected material from patterned surfaces. These systems sit within the thin-film and pattern-transfer portions of microfabrication.
Where it fits in the process flow
General reference — not yet source-verifiedIn a fabrication flow, PECVD generally follows earlier surface-cleaning or patterning steps and is followed by metrology, further patterning, or downstream integration of the deposited film into the device stack.
Applications
The PECVD configuration is used to deposit amorphous silicon, silicon oxide, silicon nitride, and silicon oxynitride. These films are used for photonics structures, passivation layers, and hard masks.[3]
What do the numbers mean?
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Publicly hosted documents referencing this tool, linked at their original location. Hosted by the linked institutions — availability may change.
- PECVD Overview from Oxford InstrumentsDocumentberkeley.edu
- Oxford-Plasmalab-80plus-Cloey-SOP-Rev-D.pdfSOPasu.edu
- Oxford-Plasmalab-80plus-Rev-C-Floey.pdfDocumentasu.edu
- Oxford PECVD Plasmalab 80Plus Standard Operating ProcedureSOPtamu.edu
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Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 80 Plus are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 80 Plus are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 80 Plus are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 80 Plus are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 80 Plus are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 80 Plus is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Oxford Plasmalab80Plus (PECVD) - AggieFab Nanofabrication Facility — aggiefab.tamu.eduaggiefab.tamu.edu
- [4]Physical Vapor Deposition — nanolab.berkeley.edunanolab.berkeley.edu
- [5]PlasmaLab M80 Plus – Chlorine - Core Research Facilities — cores.research.asu.educores.research.asu.edu
- [6]University-of-Utah-94-721002-System-Manual — nanofab.utah.edunanofab.utah.edu
- [7]Oxford Plasmalab 80 Plus | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
- [8]PECVD System Manual - Maryland University 94-219896 .pdf — nanocenter.umd.edunanocenter.umd.edu
Last updated Jul 29, 2026.
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